Curable composition
AssigneeKaneka Corporation
InventorsYoshikatsu Ichiryu, Katsuya Ouchi
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AssigneeKaneka Corporation
InventorsYoshikatsu Ichiryu, Katsuya Ouchi
Estimating the term…
Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds: (α1) an organic compound having 2 to 6 carbon-carbon double bonds reactive with a SiH group in a molecule; (β1) a linear and/or cyclic polyorganosiloxane compound having at least two SiH groups in a molecule; and (γ1) an organic compound having at least one epoxy group or oxetanyl group and one carbon-carbon double bond reactive with a SiH group in a molecule.
A modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds:
Dependencies are inferred from the claim text.