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US 8,263,697 B2Granted
Heat-resistant resin composition
AssigneeAsahi Kasei Chemicals Corporation
InventorsTakaaki Miyoshi, Kazuya Noda
Life of this patent
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Abstract
Disclosed is a resin composition comprising an aromatic polyamide having a terminal amino group concentration of 5 to 45 μmoles/g inclusive, polyphenylene ether, a compatibilizing agent for the polyamide and the polyphenylene ether, and a crystal nucleating agent. The composition is extremely useful in an automotive body panel (e.g., an automotive fender), an SMT-compliant component or the like.
Claims20
A resin composition comprising:
- an aromatic polyamide composed of:
- dicarboxylic acid units (a) containing 60 to 100% by mole of terephthalic acid units, and
- diamine units (b) containing 60 to 100% by mole of 1,9-nonamethylenediamine units (b-1) and/or 2-methyl-1,8-octamethylenediamine units (b-2);
- polyphenylene ether;
- a compatibilizer for the polyamide and the polyphenylene ether;
- and
- a crystal nucleating agent,
- wherein the aromatic polyamide has a terminal amino group concentration of 5 μmol/g or more and 40 μmol/g or less.
5 more elements
A film having a thickness of 1 to 200 μm, comprising a resin composition comprising:
- 80 to 40 parts by mass of an aromatic polyamide composed of:
- dicarboxylic acid units (a) containing 60 to 100% by mole of terephthalic acid units, and
- diamine units (b) containing 60 to 100% by mole of 1,9-nonamethylenediamine units (b-1) and/or 2-methyl-1,8-octamethylenediamine units (b-2);
- 20 to 60 parts by mass of polyphenylene ether;
- and
- 0.05 to 5 parts by mass of a compatibilizer for the polyamide and the polyphenylene ether,
- wherein the aromatic polyamide has a terminal amino group concentration of 5 μmol/g or more and 40 μmol/g or less.
4 more elements
A semitransparent molding comprising a resin composition comprising:
- 80 to 40 parts by mass of an aromatic polyamide composed of:
- dicarboxylic acid units (a) containing 60 to 100% by mole of terephthalic acid units, and
- diamine units (b) containing 60 to 100% by mole of 1,9-nonamethylenediamine units (b-1) and/or 2-methyl-1,8-octamethylenediamine units (b-2);
- 20 to 60 parts by mass of polyphenylene ether;
- and
- 0.05 to 5 parts by mass of a compatibilizer for the polyamide and the polyphenylene ether, wherein
- the aromatic polyamide has a terminal amino group concentration of 5 μmol/g or more and 40 μmol/g or less,
- the resin composition has a morphology with the polyphenylene ether in a dispersed phase and the aromatic polyamide in a continuous phase, and
- the molding has a total light transmittance (JIS K7361-1) of 10% or more and a haze (JIS K7136) of 95% or less.
6 more elements
Dependencies are inferred from the claim text.