Hot melt pressure sensitive adhesives for paper labels

A hot melt pressure sensitive adhesive (HMPSA) composition comprising:

• a) from 30 to 50% of a mixture of styrenic block copolymers comprising:
• 10 to 70% of at least one SX1S triblock copolymer, and
• 30 to 90% of at least one SX2 diblock copolymer;
• wherein:
• S represents a polymerized segment of a styrene monomer,
• X1 and X2, are identical or different, and each represents an elastomeric polymerized segment of one or two monomers comprising isoprene, butadiene or their respective hydrogenated derivatives;
• b) from 40 to 55% of one or more tackifying resin(s), each of the one or more tackifying resin(s) having a softening temperature of between 70 and 150° C., wherein the one or more tackifying resin(s) comprises a tackifying resin (i) obtainable by hydrogenating, polymerizing or copolymerizing mixtures of aliphatic unsaturated hydrocarbons having from 5, 9 or 10 carbon atoms;
• c) from 4 to 20% of a hydrocarbon oil with an aromatic content less than 15%;
• and
• d) from 1 to 6% of a filler comprising a low molecular weight homopolymer or copolymer of polyethylene with an average number molecular weight between 1 and 5 kDa.

A hot melt pressure sensitive adhesive (HMPSA) composition comprising:

• a) from 30 to 50% of a mixture of styrenic block copolymers comprising:
• 10 to 70% of at least one SX1S triblock copolymer, and
• 30 to 90% of at least one SX2 diblock copolymer;
• wherein:
• S represents a polymerized segment of a styrene monomer,
• X1 and X2, are identical or different, and each represents an elastomeric polymerized segment of one or two monomers comprising isoprene, butadiene or their respective hydrogenated derivatives;
• b) from 40 to 55% of one or more tackifying resin(s), each of the one or more tackifying resin(s) having a softening temperature between 70 and 150° C., wherein the one or more tackifying resin(s) comprises a tackifying resin (i) obtainable by hydrogenating, polymerizing or copolymerizing mixtures of aliphatic unsaturated hydrocarbons having from 5, 9 or 10 carbon atoms;
• c) from 4 to 20% of a hydrocarbon oil with an aromatic content less than 15%;
• and
• d) from 3 to 5% of a filler comprising a low number average molecular weight homopolymer or copolymer of polyethylene.

A hot melt pressure sensitive adhesive (HMPSA) composition comprising:

• a) from 30 to 50% of a mixture of styrenic block copolymers comprising:
• 10 to 70% of at least one SX1S triblock copolymer, and
• 30 to 90% of at least one SX2 diblock copolymer;
• wherein:
• S represents a polymerized segment of a styrene monomer,
• X1 and X2, are identical or different, and each represents an elastomeric polymerized segment of one or two monomers comprising isoprene, butadiene or their respective hydrogenated derivatives;
• b) from 40 to 55% of one or more tackifying resin(s), each of the one or more tackifying resin(s) having a softening temperature between 70 and 150° C., wherein the one or more tackifying resin(s) comprises a tackifying resin (i) obtainable by hydrogenating, polymerizing or copolymerizing mixtures of aliphatic unsaturated hydrocarbons having from 5, 9 or 10 carbon atoms;
• c) from 4 to 20% of a hydrocarbon oil with an aromatic content less than 15%;
• and
• d) from 3 to 5% of a filler comprising a low molecular weight homopolymer or copolymer of polyethylene with a number average molecular weight between 1 and 5 kDa.

A hot melt pressure sensitive adhesive (HMPSA) composition comprising:

• a) from 25 to 35% of a mixture of styrenic block copolymers comprising:
• a first mixture comprising about 25% of a styrene-butadiene-styrene copolymer having a weight average molecular weight of about 170 kDa and about 75% of a styrene-butadiene copolymer having a weight average molecular weight of about 70 kDa, wherein said first mixture comprises about 30% styrene, and
• a second mixture comprising a styrene-butadiene copolymer having about 30% styrene and a weight average molecular weight of about 100 kDa;
• b) about 47% of a tackifying resin comprising a hydrogenated dicyclopentadiene modified by an aromatic compound, having a softening temperature of about 100° C.;
• a hydrogenated dicyclopentadiene modified by an aromatic compound, having a softening temperature of about 90° C.;
• a terpene phenolic resin, having a softening temperature of about 95° C.;
• or mixtures thereof;
• c) from 12 to 18% of a hydrocarbon oil comprising about 5% aromatic hydrocarbon, about 47% paraffinic carbon, and about 48% naphthenic carbon;
• d) from 3 to 5% of a filler comprising a low molecular weight homopolymer or copolymer of polyethylene with an average number molecular weight between 1 and 5 kDa.

A hot melt pressure sensitive adhesive (HMPSA) composition comprising:

• a) from 30 to 50% of a mixture of styrenic block copolymers comprising:
• 10 to 70% of at least one SX1S triblock copolymer, and
• 30 to 90% of at least one SX2 diblock copolymer;
• wherein:
• S represents a polymerized segment of a styrene monomer,
• X1 and X2, are identical or different, and each represents an elastomeric polymerized segment of one or two monomers comprising isoprene, butadiene or their respective hydrogenated derivatives;
• wherein the overall styrene monomer content in said mixture of styrenic block copolymers is between 14 and 40%;
• b) from 40 to 55% of one or more tackifying resin(s), each of the one or more tackifying resin(s) having a softening temperature of between 70 and 150° C., wherein the one or more tackifying resin(s) comprises a tackifying resin (i) comprising residues of aliphatic unsaturated hydrocarbons having from 5, 9 or 10 carbon atoms;
• c) from 4 to 20% of a hydrocarbon oil with an aromatic content less than 15%;
• and
• d) from 1 to 6% of a filler comprising a low number average molecular weight homopolymer or copolymer of polyethylene.