Forming substrate structure by filling recesses with deposition material
AssigneeSynos Technology, Inc.
InventorSang In Lee
Life of this patent
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Abstract
A substrate structure is produced by forming a first material layer on a substrate having a recess, removing the first material layer from the portion of the substrate except for the recess using a second material that reacts with the first material, and forming a deposition film from the first material layer using a third material that reacts with the first material. A method of manufacturing a device may include the method of forming a substrate structure.
Claims53
A method for forming a substrate structure, comprising:
- exposing surfaces of a substrate to a first material, one or more recesses formed on the substrate injected with the first material;
- injecting a purge gas onto the surfaces of the substrate to remove the first material physically adsorbed on the surfaces of the substrate and the first material in the one or more recesses;
- removing first material chemically adsorbed on the substrate from the surfaces of the substrate other than surfaces of the substrate in the one or more recesses using a second material that reacts with the first material;
- and
- forming a deposition film on the surfaces of the substrate in the one or more recesses by exposing the substrate to a third material that reacts with the first material layer.
A method of manufacturing a device comprising the method of forming a substrate structure, comprising:
- exposing surfaces of a substrate to a first material, one or more recesses formed on the substrate injected with the first material;
- injecting a purge gas onto the surfaces of the substrate to remove the first material physically adsorbed on the surfaces of the substrate and the first material in the one or more recesses;
- removing first material chemically adsorbed on the substrate from the surfaces of the substrate other than surfaces of the substrate in the one or more recesses using a second material that reacts with the first material;
- and
- forming a deposition film on the surfaces of the substrate in the one or more recesses by exposing the substrate to a third material that reacts with the first material layer.
A method of forming a substrate structure, comprising:
- exposing surfaces of the substrate to a source precursor, the substrate having one or more recesses;
- exposing the surfaces of the substrate to a reactant precursor to form an atomic layer of a deposition film on the surfaces of the substrate;
- and
- removing the deposition film from the substrate other than surfaces of the one or more recesses using a first material that reacts with the deposition film, wherein removing the deposition film comprises exposing the substrate to UV (Ultraviolet) light with an incident angle of UV (Ultraviolet) light adjusted such that the UV light is not radiated in the one or more recesses.
Dependencies are inferred from the claim text.