Etching method for preparing a stepped structure
AssigneeTokyo Electron Limited
InventorNorman Wodecki
Life of this patent
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Abstract
A method of preparing a stepped structure in a multi-layer film stack on a substrate is described. The multi-layer film stack includes alternating layers of differing composition, wherein the alternating layers of differing composition include one or more layers of a first composition and one or more layers of a second composition. The method includes transferring a mask pattern to the one or more layers of the first composition to form a first layer pattern in the one or more layers of the first composition using a first etch process, trimming the mask pattern to expose another portion of the one or more layers of the first composition using a mask trim process, and following the trimming, transferring the first layer pattern to the one or more layers of the second composition using a second etch process.
Claims20
A method for forming a stepped structure on a substrate, comprising:
- preparing a multi-layer film stack on a substrate having alternating layers of differing composition, wherein said alternating layers of differing composition include one or more layers of a first composition and one or more layers of a second composition;
- preparing a mask layer on said multi-layer film stack and forming a mask pattern in said mask layer to expose a portion of said one or more layers of said first composition;
- and
- preparing a stepped structure having one or more steps using a process sequence comprising the following:
- transferring said mask pattern to said one or more layers of said first composition to form a first layer pattern in said one or more layers of said first composition using a first etch process and stopping on said one or more layers of said second composition,
- trimming said mask pattern to expose another portion of said one or more layers of said first composition using a mask trim process, and
- following said trimming, transferring said first layer pattern to said one or more layers of said second composition using a second etch process and stopping on said one or more layers of said first composition.
Dependencies are inferred from the claim text.