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US 8,263,491 B2Granted
Substrate with feedthrough and method for producing the same
AssigneeInfineon Technologies AG
InventorsFlorian Binder, Stephan Dertinger, Barbara Hasler, Alfred Martin, Grit Sommer, Holger Torwesten
Life of this patent
Estimating the term…
Abstract
A substrate has at least one feedthrough with at least one channel from a first main surface of the substrate to a second main surface of the substrate. The at least one channel is closed off with a first material. The at least one closed-off channel is filled with an electrically conductive second material.
Claims17
A method for producing a substrate with at least one feedthrough, the method comprising:
- providing a substrate having at least one channel from a first main surface of the substrate to a second main surface of the substrate;
- forming a first insulation layer of tetraethyl orthosilicate to cover the first main surface and the second main surface of the substrate, and an inner surface of the at least one channel;
- applying a barrier layer of at least one of TiN and TaN to the first inulation layer;
- applying a metal layer to entirely cover only the first main surface of the substrate and partially cover only a portion of the inner surface of the at least one channel adjacent to the first main surface of the substrate;
- closing off the at least one channel with an electrically conductive first material;
- and
- filling the closed-off at least one channel with an electrically conductive second material,
- wherein only a portion of the electrically conductive second material adjacent to the first main surface of the substrate is in direct contact with a vertical portion of the metal layer, and wherein only the first main surface of the substrate is entirely covered by a horizontal portion of the metal layer.
5 more elements
A method for producing a substrate with at least one feedthrough, the method comprising:
- providing a substrate having at least one channel from a first main surface of the substrate to a second main surface of the substrate;
- forming a first insulation layer of tetraethyl orthosilicate to cover the first main surface and the second main surface of the substrate, and an inner surface of the at least one channel;
- applying a barrier layer of at least one of TiN and TaN to the first inulation layer;
- applying a metal layer to entirely cover only the first main surface of the substrate and partially cover only a portion of the inner surface of the at least one channel adjacent to the first main surface of the substrate;
- closing off the at least one channel with an electrically conductive first material;
- and
- filling the closed-off at least one channel with a hard solder,
- wherein only a portion of the electrically conductive second material adjacent to the first main surface of the substrate is in direct contact with a vertical portion of the metal layer, and wherein only the first main surface of the substrate is entirely covered by a horizontal portion of the metal layer.
5 more elements
A method for producing a substrate with at least one feedthrough, the method comprising:
- providing a substrate having at least one channel from a first main surface of the substrate to a second main surface of the substrate;
- generating a first insulation layer of tetraethyl orthosilicate to cover the first main surface and the second main surface of the substrate, and an inner surface of the at least one channel;
- applying a barrier layer of at least one of TiN and TaN to the first inulation layer;
- applying a metal layer to entirely cover only the first main surface of the substrate and partially cover only a portion of the inner surface of the at least one channel adjacent to the first main surface of the substrate;
- closing off the at least one channel with a first material;
- and
- filling the closed-off at least one channel with an electrically conductive second material selectively to the first insulation layer,
- wherein only a portion of the electrically conductive second material adjacent to the first main surface of the substrate is in direct contact with a vertical portion of the metal layer, and wherein only the first main surface of the substrate is entirely covered by a horizontal portion of the metal layer.
5 more elements
Dependencies are inferred from the claim text.