Apparatus for restricting moisture ingress

A method of providing an electrical circuit apparatus in an implantable medical device, wherein the electrical circuit apparatus comprises a moisture ingress bather, and further wherein the method comprises:

• providing a first portion comprising:
• a substrate, and
• one or more layers formed on the substrate terminating at a substantially planar connection surface, wherein the one or more layers comprise:
• at least one circuit device comprising electrical circuitry, wherein a perimeter region is defined laterally surrounding the at least one circuit device, and
• at least one metallic structure laterally of the at least one circuit device and forming at least part of the moisture ingress barrier, wherein the metallic structure extends from the substrate to the substantially planar connection surface and is located within the perimeter region;
• and
• providing a second portion comprising a substantially planar connection surface, wherein providing the second portion comprises providing a substrate;
• and
• bonding the connection surface of the first portion to the connection surface of the second portion to form a hermetic interface proximate the metallic structure of the first portion, wherein the hermetic interface forms at least a part of the moisture ingress barrier.

A method of providing an electrical circuit apparatus in an implantable medical device, wherein the electrical circuit apparatus comprises a moisture ingress barrier, and further wherein the method comprises:

• providing a first portion comprising:
• a substrate, and
• one or more layers formed on the substrate terminating at a substantially planar connection surface, wherein the one or more layers comprise:
• at least one circuit device comprising electrical circuitry, wherein a perimeter region is defined laterally surrounding the at least one circuit device, and
• at least one metallic structure laterally of the at least one circuit device and forming at least part of the moisture ingress bather, wherein the metallic structure extends from the substrate to the substantially planar connection surface and is located within the perimeter region;
• and
• providing a second portion comprising:
• a substrate, and
• one or more layers formed on the substrate terminating at a substantially planar connection surface, wherein the one or more layers comprise:
• at least one circuit device comprising electrical circuitry, wherein a perimeter region is defined laterally surrounding the at least one circuit device, and
• at least one metallic structure laterally of the at least one circuit device and forming at least part of the moisture ingress barrier, wherein the metallic structure extends from the substrate to the substantially planar connection surface and is located within the perimeter region;
• and
• bonding the connection surface of the first portion to the connection surface of the second portion to form a hermetic interface proximate the metallic structures of the first and second portions, wherein the hermetic interface forms at least a part of the moisture ingress barrier.

A method of providing an electrical circuit apparatus in an implantable medical device, wherein the method comprises:

• providing a first portion comprising:
• a substrate,
• one or more layers formed on the substrate terminating at a substantially planar connection surface, and
• at least one circuit device comprising electrical circuitry, wherein a perimeter region is defined laterally surrounding the at least one circuit device;
• and
• providing a second portion comprising a substantially planar connection surface, wherein providing the second portion comprises providing a substrate;
• and
• bonding the connection surface of the first portion to the connection surface of the second portion to provide a moisture ingress barrier, wherein the moisture ingress barrier comprises at least one metallic structure adjacent at least a portion of least one circuit device extending from the substrate of the first portion to the connection surface of the first portion and a hermetic interface proximate the metallic structure of the first portion formed upon bonding the connection surface of the first portion to the connection surface of the second portion.

A method of providing at least one electrical circuit apparatus in an implantable medical device, the at least one electrical circuit apparatus comprising a moisture ingress barrier, wherein the method comprises:

• providing a first portion, wherein the first portion comprises a substantially planar connection surface, wherein providing the first portion comprises:
• providing a wafer substrate, and
• providing one or more layers formed on the substrate terminating at the connection surface, wherein the one or more layers comprise:
• at least one circuit device comprising electrical circuitry, wherein a perimeter region is defined laterally surrounding the at least one circuit device,
• at least one metallic structure formed adjacent at least a portion of the at least one circuit device and forming at least part of the moisture ingress barrier of the at least one electrical circuit apparatus, wherein the at least one metallic structure extends from the substrate to the connection surface and is located within the perimeter region, and
• at least one electrical interconnect formed in the one or more layers of the first portion and extending from the at least one circuit device to a location within the perimeter region, wherein the at least one electrical interconnect passes through one or more insulated locations of the at least one metallic structure;
• and
• providing a second portion, wherein the second portion comprises a substantially planar connection surface, wherein providing the second portion comprises providing a wafer substrate, and further wherein one or more interconnect vias are formed in at least one of the first portion and the second portion and terminate at one or more surface contacts at a surface of at least one of the first and second portions, wherein the at least one electrical interconnect of the first portion connects to the one or more interconnect vias;
• and
• coupling the connection surface of the first portion to the connection surface of the second portion to form at least one hermetic interface proximate the at least one metallic structure of the first portion, wherein the at least one hermetic interface forms at least part of the moisture ingress barrier of the at least one electrical circuit apparatus.