Bond pad isolation and current confinement in an LED using ion implantation
AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorsSan Yu, Chi-Chun Chen
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Abstract
An improved method of creating LEDs is disclosed. Rather than using a dielectric coating to separate the bond pads from the top surface of the LED, this region of the LED is implanted with ions to increase its resistivity to minimize current flow therethrough. In another embodiment, a plurality of LEDs are produced on a single substrate by implanting ions in the regions between the LEDs and then etching a trench, where the trench is narrower than the implanted regions and positioned within these regions. This results in a trench where both sides have current confinement capabilities to reduce leakage.
Claims9
A method of creating an LED, comprising:
- forming a device having a p-type layer, a multi-quantum well and a n-type layer disposed vertically on a substrate;
- implanting ions into a portion of a first surface of said device such that said ions implant said multi-quantum well and at least one of said n-type layer and said p-type layer so as to create implanted regions, whereby said ions increase the resistivity of said implanted regions;
- removing said substrate and turning said device to expose a second surface;
- implanting ions into a portion of said second surface of said device opposite said first surface such that said ions implant at least one of said n-type layer and said p-type layer so as to create said implanted regions;
- and
- attaching a bond pad to said device over said implanted regions.
Dependencies are inferred from the claim text.