Ti-based film forming method and storage medium
AssigneeTokyo Electron Limited
InventorsKensaku Narushima, Satoshi Wakabayashi, Takamitsu Takayama
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AssigneeTokyo Electron Limited
InventorsKensaku Narushima, Satoshi Wakabayashi, Takamitsu Takayama
Estimating the term…
A Ti-based film forming method includes a step (step 1) of cleaning inside a chamber by introducing a cleaning gas containing fluorine into the chamber in a state where a wafer W is not provided on a susceptor; a step (step 2) of heating the susceptor in a state where the wafer W is not provided on the susceptor, injecting a processing gas containing Ti from a shower head into the chamber, and forming a pre-coated film at least on the surface of the shower head; and a step (step 3) of mounting the wafer W on the susceptor 2 in a state where the susceptor is heated, supplying a processing gas into the chamber 1 and forming a Ti-based film on the wafer W. The pre-coated film forming step is performed at a temperature lower than that in the film forming step.
A Ti-based film forming method for forming a Ti-based film on a surface of an object to be processed by using an apparatus including a chamber accommodating the object to be processed, a gas injecting member for injecting a processing gas containing Ti into the chamber, the gas injecting member having a first heating unit, a mounting table for mounting thereon the object to be processed in the chamber, wherein the mounting table has at least a surface made of a material containing Al, and a second heating unit for heating the mounting table, the Ti-based film forming method comprising:
Dependencies are inferred from the claim text.