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US 8,263,177 B2Granted
Organic polymer coating for protection against creep corrosion
OwnerKesheng Feng, Nilesh Kapadia +1inventors
InventorsKesheng Feng, Nilesh Kapadia, Witold Paw
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Abstract
A process is described for treating metal surfaces printed wiring boards and similar substrates to provide improved creep corrosion resistance on such surfaces. A modified organic solderability preservative composition is used in combination with an emulsion polymer to provide a modified polymer coating on the metal surface finish via a chemical reaction to provide enhanced corrosion protection of the surface.
Claims13
A method of improving creep corrosion resistance of a metal surface on a printed wiring board, the method comprising the steps of:
- a) contacting the metal surface on the printed wiring board with an aqueous organic solution comprising a material selected from the group consisting of azoles, imidazoles, and benzimidazoles;
- and thereafter
- b) contacting the metal surface, which has been contacted with the aqueous organic solution in step (a), with an aqueous emulsion polymer mixture comprising an emulsion polymer;
- wherein the emulsion polymer comprises at least one acid or amine functional group and wherein the metal surface comprises copper, silver or alloys of copper or silver.
1 more element
A printed wiring board comprising:
- (i) a metal surface comprising copper or silver;
- (ii) a coating comprising a material selected from the group consisting of azoles, imidazoles, benzimidazoles, which coating is on the metal surface;
- (iii) a layer of an emulsion polymer which emulsion polymer comprises at least one acid or amine functional group and which layer is located upon the coating;
- wherein the emulsion polymer is chemically reacted with the coating.
1 more element
Dependencies are inferred from the claim text.