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US 8,262,895 B2Granted
Plating bath and method
AssigneeRohm and Haas Electronic Materials LLC
InventorsZukhra I. Niazimbetova, Maria Anna Rzeznik
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Abstract
Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
Claims11
A copper electroplating bath comprising:
- a source of copper ions, an electrolyte, and a leveling agent, wherein the leveling agent is a reaction product of one or more benzimidazole compounds with one or more epoxide-containing compounds;
- wherein at least one benzimidazole compound has the formula
- wherein R1 is selected from H, (C1-C3)alkyl, ar(C1-C3)alkyl, hydroxy(C1-C3)alkyl and hydroxy;
- each R2 is independently selected from (C6-C18)aryl, (C1-C3)alkyl, ar(C1-C3)alkyl, hydroxy(C1-C3)alkyl and hydroxy;
- and a=0-4, provided that a >0 when R1═H.
2 more elements
Dependencies are inferred from the claim text.