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US 8,262,894 B2Granted
High speed copper plating bath
AssigneeMoses Lake Industries, Inc.
InventorsXingling Xu, Eric Webb
Life of this patent
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Abstract
A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.
Claims25
A method of changing a copper concentration in an electroplating bath, comprising:
- placing a substrate in a copper electroplating bath comprising an acidic, aqueous solution exhibiting a copper ion concentration;
- disposing a copper salt in solid form within a container located in the copper electroplating bath, a chamber of the container being in fluid communication with an the aqueous solution of the copper electroplating bath;
- dissolving at least some of the copper salt in solid form to raise the copper ion concentration in the aqueous solution and maintain the copper ion concentration in the aqueous solution at about saturation to achieve high copper ion concentrations for accommodating high speed plating;
- and
- electroplating copper on the substrate using a copper containing anode.
2 more elements
Dependencies are inferred from the claim text.