Leveler compounds
AssigneeRohm and Haas Electronic Materials LLC
InventorsDeyan Wang, Robert D. Mikkola, George G. Barclay
Life of this patent
Estimating the term…
Abstract
Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.
Claims7
A composition comprising a source of metal ions, an electrolyte, and a polymeric leveling agent comprising as polymerized units an ethyleneically unsaturated nitrogen-containing heterocyclic monomer and a (meth)acrylate monomer, the polymeric leveling agent is included in the composition in amounts of 0.5 ppm to 10.000 ppm.
Dependencies are inferred from the claim text.