Methods for passivating a metal substrate and related coated metal substrates
AssigneePPG Industries Ohio, Inc.
InventorsThor Lingenfelter, Richard F Karabin, Edward F Rakiewicz
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Abstract
Disclosed are methods for passivating metal substrates, including ferrous substrates, such as cold rolled steel and electrogalvanized steel. The methods comprise the steps of autodepositing copper, silver, a IIIB metal and/or IVB metal onto at least a portion of the substrate, and simultaneously and/or immediately subsequently electrophoretically depositing on the substrate a curable, electrodepositable coating composition; wherein the copper, silver, IIB metal and/or IVB metal and the curable, electrodepositable coating composition are both contained within a single bath composition. The present invention also relates to coated substrates produced by the above methods.
Claims15
A method for passivating a metal substrate surface comprising:
- (a) exposing the substrate in the absence of an applied electrical current to a bath composition that contains a copper compound, a silver compound, a group IIIB metal compound, and/or a group IVB metal compound for at least 5 seconds, thereby autodepositing copper, silver, a IIIB metal and/or a IVB metal onto at least a portion of the substrate surface, and immediately subsequently
- (b) electrophoretically depositing on the substrate a curable, electrodepositable coating composition;
- wherein the copper compound, silver compound, group IIIB metal compound and/or a group IVB metal compound and the curable, electrodepositable coating composition are both contained within a single bath composition.
Dependencies are inferred from the claim text.