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US 8,262,831 B2Granted
Method for forming a circuit pattern
AssigneeC. Uyemura & Co., Ltd.
InventorsShigeo Hashimoto, Teruyuki Hotta, Takahiro Ishizaki
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Abstract
A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.
Claims3
A method for forming a circuit pattern comprising:
- a pattern forming step of forming a circuit pattern on an insulating resin by coating and curing an electrically conductive paste by an ink jet system;
- a seed layer forming step of forming a seed layer by electroless plating on the cured electrically conductive paste that forms the circuit pattern;
- a laminating step of laminating an insulating resin layer on the insulating resin on which the circuit pattern has been formed;
- a trench forming step of forming a trench in the insulating resin layer laminated in the laminating step to expose the circuit pattern;
- and
- an electroless plating step of burying plating metal by electroless plating in the trench formed in the trench forming step.
3 more elements
Dependencies are inferred from the claim text.