Method for manufacturing divided waveplate filter

#1. Field of the Invention

#The present invention relates to a method for manufacturing a divided waveplate filter for, for example, a stereoscopic image display unit.

#2. Description of the Related Art

#FIG. 1 illustrates a forming process of a divided waveplate filter according to a first embodiment of the present invention;

#FIG. 2 is a schematic view of a printing device according to the first embodiment of the present invention;

#FIG. 3 illustrates a manufacturing process of a divided waveplate filter according to a second embodiment of the present invention;

#The preferred embodiments according to the present invention will now be described with reference to the drawings.

#According to the embodiments of the present invention, for example, a divided waveplate material layer, which is a material layer for the divided waveplates, an alignment film material, and an adhesive layer are formed mainly by printing or by bonding, in the formation process of each layer. The process includes three different methods. In a method, the adhesive layer is formed on a substrate such that the layer has a predetermined division pattern, a film having phase-difference characteristic is attached, and the film is cut and removed such that the film also has the predetermined division pattern. In another method, the alignment film material layer is formed on the entire surface or areas defined by the division pattern, the alignment film material layer is subjected to orientation treatment, the divided waveplate material layer is formed on the entire surface or areas defined by the division pattern, and the resultant substrate is exposed to form the divided waveplate. In another method, the divided waveplate material layer is disposed on a substrate and is directly subjected to orientation treatment to form the divided waveplate.

#FIG. 1 illustrates a forming process of the divided waveplates according to the present embodiment for dividing a divided waveplate material layer into a predetermined division pattern. The process includes the steps of printing an adhesive on a substrate; disposing a divided waveplate material layer; and cutting the divided waveplate material layer to form the division pattern. Part (a) in FIG. 1 shows the substrate with the adhesive formed thereon; part (b) in FIG. 1 shows the substrate further having a divided waveplate material layer attached thereon; and part (c) in FIG. 1 shows the substrate wherein the divided waveplate material layer is cut. Common reference numerals are used for the common portions in the conventional art shown in FIG. 19 (as well in other embodiments).