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US 8,262,824 B2Granted
Method for manufacturing electret diaphragm
AssigneeHTC Corporation
InventorFang Ching Lee
Life of this patent
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Abstract
A method for manufacturing electret diaphragms is provided. First, a dielectric film is attached to a frame by an adhesive material and a fastening element grips the peripheral area of the dielectric film on the frame. Afterward, the dielectric film is subjected to a metal sputtering process to form a conductive material layer thereon. Finally, the dielectric film is subjected to a polarizing process thereby forming an electret diaphragm.
Claims20
A method for manufacturing an electret diaphragm, comprising:
- providing a frame with an upper surface and a lower surface;
- applying an adhesive material to the upper surface of the frame;
- attaching a dielectric film to the adhesive material on the upper surface of the frame, the dielectric film having an upper surface and a lower surface;
- providing a clamping element to clamp the peripheral area of the dielectric film on the frame;
- forming a conductive material layer on the upper surface of the dielectric film with the peripheral area of the dielectric film clamped on the frame by the clamping element;
- and
- polarizing the dielectric film.
4 more elements
Dependencies are inferred from the claim text.