High reliability cooling system for LED lamps using dual mode heat transfer loops
OwnerKhanh Dinhinventor
Life of this patent
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Abstract
In one aspect, a cooling device for an LED chip mounted on a heat sink includes an enclosed tube in contact with the heat sink. The tube includes a vacuum section surrounded by a plurality of cooling fins and a liquid-filled section surrounded by a plurality of cooling fins. The liquid-filled section is in contact with the heat sink. In another aspect, an apparatus includes a heat sink, an LED chip mounted on the heat sink, and an enclosed tube in contact with the heat sink. The tube includes a vacuum section surrounded by a plurality of cooling fins and a liquid-filled section surrounded by a plurality of cooling fins. The liquid-filled section is in contact with the heat sink.
Claims12
A cooling device for a heat emitting device mounted on a heat sink, the device comprising:
- an enclosed tube in contact with the heat sink, wherein the heat sink is disposed in a case, the tube configured in a loop comprising an additional path within the loop, the tube comprising:
- a vacuum section connected to a first plurality of cooling fins;
- and
- a liquid-filled section connected to a second plurality of cooling fins, wherein the liquid-filled section is in contact with the heat sink, wherein a portion of the liquid-filled section connected to the second plurality of cooling fins forms a thermo-siphon cooling section on the additional path, wherein the additional path is disposed outside the case;
- and
- wherein the liquid-filled section is disposed lower than the vacuum section due to gravity.
An apparatus comprising:
- a case;
- a heat sink disposed in the case;
- a heat emitting device mounted on the heat sink;
- and
- an enclosed tube in contact with the heat sink, the tube configured in a loop comprising an additional path within the loop, the tube comprising:
- a vacuum section connected to a first plurality of cooling fins;
- and
- a liquid-filled section connected to a second plurality of cooling fins, wherein the liquid-filled section is in contact with the heat sink, wherein a portion of the liquid-filled section connected to the second plurality of cooling fins forms a thermo-siphon cooling section on the additional path, wherein the additional path is disposed outside the case;
- and
- wherein the liquid-filled section is disposed lower than the vacuum section due to gravity.
Dependencies are inferred from the claim text.