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US 8,261,997 B2Granted
Surface-tolerant RFID transponder device
AssigneeNXP B.V.
InventorMichael Gebhart
Life of this patent
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Abstract
A carrier assembly for receiving an RFID transponder chip has an attachment side for being attached to a consumer device and an operation side for receiving an RF signal in operational use of the RFID transponder chip.
Claims14
A carrier assembly for receiving an RFID transponder chip, the carrier assembly having an attachment side for being attached to a consumer device and having an operation side for receiving an RF signal in operational use of the RFID transponder chip, wherein:
- the carrier assembly comprises a layer stack that includes an antenna layer, a magnetic layer, and an electrically conductive shielding layer;
- the antenna layer is arranged between the operation side and the magnetic layer;
- the electrically conductive shielding layer is arranged between the magnetic layer and the attachment side;
- the antenna layer comprises an antenna having contacts for being coupled to the RFID transponder chip;
- and
- an outer contour of a first projection of the antenna in a direction perpendicular to the antenna layer fully encloses an outer contour of a second projection of the electrically conductive shielding layer in the direction perpendicular to the antenna layer.
3 more elements
Dependencies are inferred from the claim text.