In-situ wafer processing system and method

An integrated wafer processing system, comprising:

• a wire sawing apparatus, wherein the wire sawing apparatus comprises:
• a wire web, wherein the wire web is a substantially vertical wire web located substantially in a vertical plane and move in a substantially vertical direction, and wherein at least one work piece is impelled against the vertical wire web;
• and
• at least one first top outlet and at least one second top outlet for applying fluids during sawing, wherein the fluids comprise an abrasive slurry and at least one cleaning fluid, wherein the at least one first top outlet being located in a top position with respect to the at least one work piece, wherein the fluids flow in a substantially downward vertical direction under a gravitational force, wherein the at least one first top outlet supplies the abrasive slurry to the at least one work piece and the abrasive slurry flows into the at least one work piece for slicing and resulting in wafer stack of cut wafers held integrally by an uncut portion or by a welded plate and the at least one second top outlet supplies the at least one cleaning fluid, wherein the at least one second top outlet being located in a top position of the cut wafers to provide the at least one cleaning fluid for cleaning the cut wafers, and wherein the at least one second top outlet is located and oriented to substantially spray the at least one cleaning fluid over the wafers as the cut wafers emerge from the vertical wire web.

An integrated wafer processing system, comprising:

• a wire sawing apparatus, wherein the wire sawing apparatus comprises:
• a wire web, wherein the wire web is a substantially vertical wire web located substantially in a vertical plane and move in a substantially vertical direction, and wherein at least one work piece is impelled against the vertical wire web;
• and
• at least one first top outlet and at least one second top outlet for applying fluids during sawing, wherein the fluids comprise an abrasive slurry and at least one cleaning fluid, wherein the at least one first top outlet being located in a top position with respect to the at least one work piece, wherein the fluids flow in a substantially downward vertical direction under a gravitational force and wherein the at least one first top outlet supplies the abrasive slurry to the at least one work piece and the abrasive slurry flows into the at least one work piece for slicing and resulting in wafer stack of cut wafers held integrally by an uncut portion or by a welded plate and the at least one second top outlet supplies the at least one cleaning fluid, wherein the at least one second top outlet being located in a top position of the cut wafers to provide the at least one cleaning fluid for cleaning the cut wafers;
• and
• at least one chute for removing the fluids, wherein the at least one chute is located substantially below the at least one work piece for receiving the fluids, wherein the fluids are applied to the top of the at least one work piece and the fluids flow in a vertical direction against and into the at least one work piece for slicing and cleaning wafers and resulting in the wafer stack of cut wafers, and wherein the at least one chute is a first chute and a second chute for separately removing each of the abrasive slurry and the at least one cleaning fluid.

An integrated wafer processing system, comprising:

• a wire sawing apparatus, wherein the wire sawing apparatus comprises:
• a wire web, wherein the wire web is a substantially vertical wire web located substantially in a vertical plane and move in a substantially vertical direction, and wherein at least one work piece is impelled against the vertical wire web;
• and
• at least one first top outlet and at least one second top outlet for applying fluids during sawing, wherein the fluids comprise an abrasive slurry and at least one cleaning fluid, wherein the at least one first top outlet being located in a top position with respect to the at least one work piece, wherein the fluids flow in a substantially downward vertical direction under a gravitational force, wherein the at least one first top outlet supplies the abrasive slurry to the at least one work piece and the abrasive slurry flows into the at least one work piece for slicing and resulting in wafer stack of cut wafers held integrally by an uncut portion or by a welded plate and the at least one second top outlet supplies the at least one cleaning fluid, wherein the at least one second top outlet being located in a top position of the cut wafers to provide the at least one cleaning fluid for cleaning the cut wafers, and wherein the at least one cleaning fluid comprises at least one surfactant, wherein the wafers in the vertical wire web are maintained in a separate condition by electrostatic repulsion.