Method for contacting electronic components by means of a substrate plate

A method for contacting at least one unpackaged electronic component, having at least one contact surface disposed in each case on at least one of a top side and a bottom side for at least one of attachment and electrical contacting, comprising:

• attaching the component by the bottom side thereof onto an electrically insulating carrier film extending beyond a surface area of the bottom side;
• at least one of attaching and electrically contacting the contact surface on the top side of the component to and/or with an electrically conducting conductor part embodying a pre-formed three-dimensional structure and extending beyond a surface area of the top side;
• producing an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part;
• removing the carrier film from the bottom side in the region of the contact surface;
• and
• at least one of attaching and electrically contacting the contact surface on the bottom side thereof to and/or with a contact surface on a direct copper bonding substrate prepatterned with electrical conductors and disposed opposite the contact surface.