Method for manufacturing surface acoustic wave device
AssigneeMurata Manufacturing Co., Ltd.
InventorsMichio Kadota, Tetsuya Kimura
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Abstract
A method for manufacturing a surface acoustic wave filter device includes a step of forming grooves in one principal surface of a piezoelectric substrate, a step of embedding a metallic film in the grooves to form IDT electrodes, a step of performing a process of removing a portion of the piezoelectric substrate from the one principal surface of the piezoelectric substrate, thereby forming a recessed portion including the bottom surface in which the IDT electrodes are embedded, and a step of bonding a cover member to the piezoelectric substrate.
Claims8
A method for manufacturing a surface acoustic wave device comprising the steps of:
- preparing a piezoelectric substrate and a cover member;
- forming, in one principal surface side of the piezoelectric substrate, grooves in portions in which an IDT electrode and a wiring electrode are to be provided;
- forming, on the one principal surface side of the piezoelectric substrate, a metallic film at least in the grooves;
- forming a recessed portion by removing one portion of the piezoelectric substrate from the one principal surface side of the piezoelectric substrate to form, using the metallic film positioned in the grooves, the IDT electrode and the wiring electrode;
- and
- bonding the cover member to the one principal surface side of the piezoelectric substrate.
Dependencies are inferred from the claim text.