Submount for electronic components

A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate;

• wherein a portion of said head member constitutes a male member of a snap fastener comprising an engaging protrusion for engaging with an engaging recess of an female member of a snap fastener.

A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate;

• wherein a portion of said head member constitutes a female member of a snap fastener comprising an engaging recess for engaging with an engaging protrusion of an male member of a snap fastener.

A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate

• wherein a conductive adhesive material is arranged on at least one of said substrate contacts.

An arrangement comprising:

• a textile substrate having a front side and a back side and comprising at least two separate conductive electrodes, and
• at least one submount, said submount comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate;
• wherein said at least one substrate-engaging member of said submount penetrates said substrate from the front side thereof, and wherein each of said conductive electrodes is in contact with a separate substrate contact of said submount.