Package structure of photodiode and forming method thereof
AssigneeSolapoint Corporation
InventorTai-Hui Liu
Life of this patent
Estimating the term…
Abstract
A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.
Claims20
A method of forming a package structure of photodiode, the method comprising:
- providing a heat-dissipation plate;
- forming a patterned solder layer on the heat-dissipation plate, wherein the patterned solder layer is for connecting the heat-dissipation plate and a circuit board;
- placing the circuit board on the heat-dissipation plate, the circuit board including:
- an opening exposing a top surface of the heat-dissipation plate;
- and
- a first contact pad located on a peripheral area of the opening;
- placing a carrier having a metal cladding surface into the opening;
- placing a photodiode chip on the carrier, wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed;
- conducting a single reflow process to solder the circuit board, the heat-dissipation plate, the carrier and the photodiode chip together;
- and
- electrically connecting the exposed metal cladding surface to the first contact pad.
A method of forming a package structure of photodiode, the method comprising:
- providing a heat-dissipation plate;
- placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad and a second contact located on a peripheral area of the opening;
- placing a protective diode on the circuit board, the protective diode being connected to the first contact pad and the second contact pad;
- providing a photodiode submount, the photodiode submount including:
- a carrier having a metal cladding surface;
- and
- a photodiode chip on the carrier, wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed;
- placing the photodiode submount into the opening;
- conducting a single reflow process to solder the circuit board, the heat-dissipation plate and the photodiode submount together;
- and
- electrically connecting the exposed metal cladding surface to the first contact pad.
A method of forming a package structure of photodiode, the method comprising:
- providing a heat-dissipation plate;
- placing a circuit board on the heat-dissipation plate, the circuit board including:
- an opening exposing a top surface of the heat-dissipation plate;
- and
- a first contact pad located on a peripheral area of the opening;
- placing a carrier having a metal cladding surface into the opening;
- placing a photodiode chip on the carrier, wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed;
- and
- electrically connecting the exposed metal cladding surface to the first contact pad by a lead frame.
Dependencies are inferred from the claim text.