Foundry compatible process for manufacturing a magneto meter using lorentz force for integrated systems

A method of fabricating an integrated electronic compass and circuit device comprising:

• providing a semiconductor substrate comprising a surface region;
• forming one or more CMOS integrated circuits formed on one or more portions of the semiconductor substrate;
• forming a thickness of dielectric material overlying the one or more CMOS integrated circuits;
• joining a substrate overlying the thickness of dielectric material;
• thinning the substrate to a predetermined thickness;
• forming one or more material layers overlying the thinned substrate;
• and
• etching the one or more material layers to form and electronic compass device having one or more electronic compass elements.

A method of fabricating an integrated electronic compass and circuit device comprising:

• providing a semiconductor substrate comprising a surface region;
• forming one or more CMOS integrated circuits formed on one or more portions of the semiconductor substrate;
• forming a thickness of dielectric material overlying the one or more CMOS integrated circuits;
• joining a substrate overlying the thickness of dielectric material;
• thinning the substrate to a predetermined thickness;
• forming one or more material layers overlying the thinned substrate;
• etching the one or more material layers to form an electronic compass device having one or more electronic compass elements;
• coupling a resonator device to the electronic compass devices;
• integrating the electronic compass device with at least one MEMS device;
• and packaging the electronic compass device and the MEMS device(s).