Method and apparatus for adjusting a substrate support

A method for dispensing solder paste onto a substrate, the method comprising:

• delivering a substrate to a substrate support of a stencil printer;
• manipulating the substrate support so as to orient the substrate in a print position, the manipulating the substrate support being achieved by moving the substrate support in a first direction and moving the substrate support in a second direction;
• and
• performing a print operation to print solder paste onto the pads of the substrate,
• wherein manipulating the substrate support is achieved by a substrate support movement assembly comprising a first movement mechanism directly coupled to a frame of the stencil printer and a bottom surface of the substrate support, the first movement mechanism being configured to move the substrate support in a first direction with respect to the frame, a second movement mechanism directly coupled to the frame and the bottom surface of the substrate support, the second movement mechanism being configured to move the substrate support in a second direction with respect to the frame, the second direction being generally perpendicular to the first direction, and a third movement mechanism, spaced from the first movement mechanism, coupled to the frame and the bottom surface of the substrate support, the third mechanism being configured to move the substrate in the first direction with respect to the frame, and
• wherein the substrate support movement assembly is capable of moving the substrate support by the first, second and third movement mechanisms in an x-direction, a y-direction and a rotational direction.