Precise metrology with adaptive milling
AssigneeWestern Digital (Fremont), LLC
InventorChester Xiaowen Chien
Life of this patent
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Abstract
A method of measuring a three-dimensional device in a wafer is provided. The method comprises the step of forming a trench in the wafer. The trench has a facet passing through the three-dimensional device a predetermined offset from a desired image position. The method further comprises iteratively, until a remaining distance between the facet and the desired image position is less than a predetermined threshold, adjusting one or more parameters of a polishing beam based on the remaining distance, polishing the facet with the polishing beam to position the facet closer to the desired image position, and measuring the remaining distance.
Claims18
A method of measuring a three-dimensional device in a wafer, comprising the steps of:
- forming a trench in the wafer, the trench having a facet passing through the three-dimensional device a predetermined offset from a desired image position;
- and
- iteratively, until a remaining distance between the facet and the desired image position is less than a predetermined threshold:
- adjusting one or more parameters of a polishing beam based on the remaining distance,
- polishing the facet with the polishing beam to position the facet closer to the desired image position, and
- measuring the remaining distance.
A method of measuring a three-dimensional device in a wafer, comprising the steps of:
- forming a trench in the wafer, the trench having a facet passing through the three-dimensional device a predetermined offset from a desired image position;
- adjusting one or more parameters of a polishing beam based on the predetermined offset;
- polishing the facet with the polishing beam to position the facet closer to the desired image position;
- measuring a remaining distance between the facet and the desired image position;
- adjusting one or more parameters of the polishing beam based on the remaining distance;
- polishing the facet with the polishing beam to position the facet closer to the desired image position;
- and
- imaging the facet.
A machine readable medium carrying one or more sequences of instructions for measuring a three-dimensional device in a wafer, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the steps of:
- forming a trench in the wafer, the trench having a facet passing through the three-dimensional device a predetermined offset from a desired image position;
- and
- iteratively, until a remaining distance between the facet and the desired image position is less than a predetermined threshold:
- adjusting one or more parameters of a polishing beam based on the remaining distance,
- polishing the facet with the polishing beam to position the facet closer to the desired image position, and
- measuring the remaining distance.
Dependencies are inferred from the claim text.