System for performing bonding a first substrate to a second substrate

A system for performing bonding of a first substrate to a second substrate, the first substrate including a first plurality of solder pads, the second substrate including a second plurality of solder pads, the system comprising:

• a first alignment mark set and a first plurality of dots on the first substrate, the first plurality of dots configured to remain substantially solid during a reflow of the first plurality of solder pads;
• and
• a second alignment mark set and a second plurality of dots on the second substrate, the second plurality of dots configured to interlock and form an interlocking key with the first plurality of dots, the first alignment mark set being aligned with the second alignment mark set corresponding to the first plurality of dots being aligned with the second plurality of dots and the first plurality of solder pads being aligned with the second plurality of solder pads, the second plurality of dots configured to remain substantially solid during the reflow.