Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

A two-dimensional stretchable and bendable device comprising:

• a. an elastomeric substrate having a contact surface;
• b. an interconnect having a first end bonded to said elastomeric substrate contact surface and a second end bonded to said elastomeric substrate contact surface, and a central portion between said first and second ends;
• wherein movement of said first end and said second ends toward each other generates a curve and physical separation between said elastomeric substrate contact surface and interconnect central portion with a maximum physical separation distance between said central portion and said elastomeric substrate contact surface that is greater than or equal to 100 nm and less than or equal to 1 mm;
• said first end connected to a first contact pad and said second end connected to a second contact pad, wherein said contact pads are substantially flat for receiving a device component and said contact pads are bonded to said substrate;
• wherein said interconnect electrically connects said first contact pad and said second contact pad, and said curved central portion provides said device stretching and bending while maintaining electrical connectivity when said contact pads move relative to one another.