Positive resist composition and patterning process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsJun Hatakeyama, Koji Hasegawa, Seiichiro Tachibana
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Abstract
A positive resist composition comprising as a base resin a polymer having carboxyl groups whose hydrogen is substituted by an acid labile group of acenaphthene structure exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a good pattern profile and minimal LER after exposure, a significant effect of suppressing acid diffusion rate, and improved etching resistance.
Claims12
A positive resist composition comprising as a base resin a polymer having carboxyl groups whose hydrogen is substituted by an acid labile group having the general formula (1):
- wherein R1 is hydrogen, a C1-C4 alkyl, alkoxy, alkanoyl or alkoxycarbonyl group, C6-C10 aryl group, halogen, or cyano group, and m is an integer of 1 to 4.
Dependencies are inferred from the claim text.