Three-dimensional array of re-programmable non-volatile memory elements having vertical bit lines and a double-global-bit-line architecture
AssigneeSanDisk 3D LLC
InventorsLuca Fasoli, George Samachisa
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AssigneeSanDisk 3D LLC
InventorsLuca Fasoli, George Samachisa
Estimating the term…
A three-dimensional array especially adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. A two-dimensional array of bit lines to which the memory elements of all planes are connected is oriented vertically from the substrate and through the plurality of planes. A double-global-bit-line architecture provides a pair of global bit lines for each bit lines for accessing a row of memory elements in parallel. A first one of each pair allows the local bit lines of the row to be sensed while a second one of each pair allows local bit lines in an adjacent row to be set to a definite voltage so as to eliminate leakage currents between adjacent rows of local bit lines.
A data memory including memory elements arranged in a three-dimensional pattern defined by rectangular coordinates having x, y and z-directions and with a plurality of parallel planes stacked in the z-direction, the memory further comprising:
A method of operating a re-programmable non-volatile memory system, comprising:
Dependencies are inferred from the claim text.