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US 8,197,894 B2Granted
Methods of forming sputtering targets
AssigneeH.C. Starck GmbH
InventorsSteven A. Miller, Olaf Schmidt-Park, Prabhat Kumar, Richard Wu, Shuwei Sun, Stefan Zimmermann
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Abstract
In various embodiments, sputter-target formation includes application of a layer having an intermediate coefficient of thermal expansion between the backing plate and the target material.
Claims15
A method of forming a sputter target, the method comprising:
- providing a structure comprising:
- a backing plate comprising a backing-plate material, and
- disposed on the backing plate, an intermediate layer;
- and
- applying to the intermediate layer a target material,
- wherein the intermediate layer (i) has a coefficient of thermal expansion (CTE) between a CTE of the backing plate and a CTE of the target material and (ii) comprises a powder mixture of the backing-plate material and the target material.
3 more elements
Dependencies are inferred from the claim text.