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US 8,194,407 B2Granted
Heat radiation material, electronic device and method of manufacturing electronic device
AssigneeFujitsu Limited
InventorsYoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
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Abstract
The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
Claims7
A heat radiation material comprising:
- a plurality of cylindrical structures made up of carbon atoms;
- a filling layer formed of a thermoplastic resin and disposed between the plurality of cylindrical structures;
- and
- a first coating film having a thickness of 25 nm to 1000 nm, formed so as to coat individual ends of the plurality of cylindrical structures and formed of a material having a higher thermal conductivity than the thermoplastic resin.
1 more element
Dependencies are inferred from the claim text.