Semiconductor package with semiconductor core structure and method of forming the same

A semiconductor device, comprising:

• an integrated passive device (IPD) structure;
• a first semiconductor die mounted to the IPD structure with a flipchip interconnect;
• a plurality of first conductive posts disposed adjacent to the first semiconductor die;
• a first molding compound disposed over the first conductive posts and first semiconductor die;
• a core structure bonded to the first conductive posts over the first semiconductor die;
• a plurality of conductive through silicon vias (TSVs) disposed in the core structure;
• a plurality of second conductive posts disposed over the core structure;
• a second semiconductor die mounted over the core structure, the second semiconductor die electrically connected to the core structure;
• and
• a second molding compound disposed over the second conductive posts and second semiconductor die.

A semiconductor device, comprising:

• an integrated passive device (IPD) structure;
• a first semiconductor die mounted to the IPD structure;
• a plurality of first conductive posts disposed over the IPD structure and outside a footprint of the first semiconductor die;
• a first molding compound deposited over the first conductive posts, IPD structure, and first semiconductor die;
• and
• a wafer core structure bonded to the first conductive posts over the first semiconductor die, the wafer core structure having sufficient area to cover the first conductive posts and first semiconductor die.

A semiconductor device, comprising:

• an integrated passive device (IPD) structure;
• a first semiconductor die mounted to the IPD structure;
• a plurality of first conductive posts disposed over the IPD structure away from the first semiconductor die;
• a core structure bonded to the first conductive posts over the first semiconductor die, the core structure including a semiconductor material and conductive TSVs;
• and
• a second semiconductor die mounted over the core structure, the second semiconductor die being electrically connected to the core structure.