Method for providing a structure in a magnetic transducer

#FIG. 1 is a flow chart depicting a conventional method 10 for fabricating a conventional perpendicular magnetic recording (PMR) transducer. For simplicity, some steps are omitted. The conventional method 10 is used for providing a PMR pole. The film stack for the pole is deposited, via step 12. Step 12 generally includes depositing seed layer(s), high moment magnetic film(s), a chemical mechanical planarization (CMP) stop layer, and one or more hard mask layers. A pattern in the hard mask layer(s) is provided, via step 14. Step 14 may include providing a photoresist mask and transferring the pattern of the photoresist mask to the hard mask layer(s). The photoresist mask pattern may be transferred by ion milling. The pole is then defined from the high moment magnetic layers, via step 18. Step 18 may also be performed by ion milling through the high moment magnetic layers. The PMR pole formed has a negative angle, with its top being wider than its bottom. The transducer is then refilled with alumina, via step 20. Thus, the regions around the pole may be filled. However, the top surface of the transducer may not be even. Consequently, a CMP may be performed, via step 22. The CMP typically terminates when at least a portion of the CMP stop layer remains. Thus, the top surface of the transducer is planarized. The CMP stop layer is then removed, for example using a reactive ion etch (RIE). Fabrication of the magnetic transducer may then be completed.

#Although the conventional method functions, there are inconsistencies in fabrication of the transducer. These inconsistencies may adversely affect both the yield of the conventional method 10 and the performance of poles formed using the conventional method 10. For example, the CMP may result in dishing and/or similar nonuniformities. As a result, the top surface of the transducer may not be as flat as desired. Formation of subsequent structures, such as shields, may be adversely affected. Performance of the transducer provided and yield of the method 10 may thus be affected.

#Accordingly, what is needed is an improved method for fabricating a PMR transducer.

#FIG. 1 is a flow chart depicting a conventional method for fabricating a PMR head.

#FIG. 2 is a flow chart depicting an exemplary embodiment of a method for fabricating a structure in a magnetic transducer.

#FIG. 3 is a flow chart depicting another embodiment of a method for fabricating a PMR transducer.

#FIG. 2 is a flow chart depicting an exemplary embodiment of a method 100 for fabricating a structure for a magnetic recording transducer. The structure described may include a PMR pole. However, other structures may also be fabricated. For simplicity, some steps may be omitted. The transducer being fabricated may be part of a merged head that includes read and write head and resides on a slider in a disk drive. The method 100 also may commence after formation of other portions of the transducer. The method 100 is also described in the context of providing a single structure in a single magnetic recording transducer. However, the method 100 may be used to fabricate multiple structure and/or multiple transducers at substantially the same time. The method 100 and system are also described in the context of particular layers. However, in some embodiments, such layers may include multiple sub-layers.

#In one embodiment, the method 100 commences after formation of some structures in the transducer have been fabricated. For example, in one embodiment, the method 100 starts after the structure has been defined. For example, for a PMR pole, a PMR pole stack including magnetic materials and a first planarization buffer layer is deposited and the PMR pole defined from the stack. A planarization buffer layer is one which slows or stops the planarization. Stated differently, the layer is more difficult to remove using the planarization step. As a result, both the PMR pole and an additional structure distal from the PMR pole would be formed prior to the method 100 starting. In one embodiment, this additional structure is a CMP or other planarization support structure. In one embodiment, the first planarization buffer layer has a thickness of at least thirty and not more than fifty nanometers. In another embodiment, the first planarization buffer layer may be thinner, for example as thin as ten nanometers. In addition to the magnetic materials and a first planarization buffer layer, one or more hard mask layers may be part of the stack. The method 100 may also start after component(s) other than the structure have been formed. For example, an intermediate layer, such as aluminum oxide, may also have been provided. The intermediate layer may cover the structure, reside between the structure and the additional structures, and reside on top of the additional structure(s). Thus, the structure/PMR pole and additional structure may both reside under portions of the intermediate layer. However, the top surface of the transducer would have a topology that reflects the discontinuity of underlying layers instead of being flat.

#A first planarization is performed, via step 102. The first planarization exposes a new top surface of the magnetic transducer and terminates before the first planarization buffer layer is removed. In one embodiment, first planarization removes part of the intermediate layer and ensures that the top surface is more uniform and substantially flat. This planarization may be a CMP configured to planarized aluminum oxide.