Electronics module, enclosure assembly housing same, and related systems and methods

An electronics module, comprising:

• a first plate extending generally in a first plane and having a center with a first opening;
• a second plate spaced from the first plate, extending generally in a second plane, and having a center with a second opening that is aligned with the first opening;
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes;
• wherein the first plate comprises a first interior surface including a plurality of radially extending first slots formed therein;
• wherein the second plate comprises a second interior surface that faces the first interior surface and includes a plurality of radially extending second slots formed therein;
• and
• wherein each electronic board assembly is inserted into a corresponding one of the first slots and a corresponding one of the second slots.

An electronics module, comprising:

• a first plate extending generally in a first plane;
• a second plate spaced from the first plate and extending generally in a second plane;
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes;
• and
• wherein each electronic board assembly comprises a first mounting device that engages the first plate and a second mounting device that engages the second plate.

An electronics module, comprising:

• a first plate extending generally in a first plane;
• a second plate spaced from the first plate and extending generally in a second plane;
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes;
• wherein each electronic board assembly comprises a first mounting device that engages the first plate and a second mounting device that engages the second plate;
• wherein the first mounting device of each electronic board assembly comprises a first locking device locked with the first plate and received by a corresponding radially extending first slot formed in the first plate;
• and
• wherein the second mounting device of each electronic board assembly comprises a second locking device locked with the second plate and received by a corresponding radially extending second slot formed in the second plate.

An electronics module, comprising:

• a first plate extending generally in a first plane;
• a second plate spaced from the first plate and extending generally in a second plane;
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes;
• and
• wherein at least one of the first and second plates comprises at least one locking feature that is adjustable to protrude from an outer edge of the at least one plate.

An electronics module, comprising:

• a first plate extending generally in a first plane;
• a second plate spaced from the first plate and extending generally in a second plane;
• and
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes;
• and
• wherein at least one of the first and second plates comprises at least one retention mechanism including a locking feature and a biasing element operable to bias the locking feature radially outward.

An electronics module, comprising:

• a first plate extending generally in a first plane;
• a second plate spaced from the first plate and extending generally in a second plane;
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes;
• a first thermally conductive gasket extending about the first plate;
• and
• a second thermally conductive gasket extending about the second plate.

An electronics module, comprising:

• a first plate extending generally in a first plane;
• a second plate spaced from the first plate and extending generally in a second plane;
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes;
• and
• wherein each electronic board assembly comprises external electrical connectors that are not located within an edge region thereof.

An enclosure assembly, comprising:

• an enclosure including an interior surface defining an interior space;
• at least one electronics module positioned within the interior space, the at least one electronics module including:
• a first plate extending generally in a first plane and including a first outer peripheral surface configured to be in thermal contact with the interior surface of the enclosure;
• a second plate extending generally in a second plane and including a second outer peripheral surface configured to be in thermal contact with the interior surface of the enclosure;
• and
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between and oriented so that the respective plane thereof is non-parallel relative to the first and second planes.

A system, comprising:

• an enclosure including an interior surface defining an interior space;
• at least one electronics module positioned within the interior space and including:
• a first plate extending generally in a first plane;
• a second plate spaced from the first plate and extending generally in a second plane;
• and
• a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates, each electronic board assembly positioned between and oriented so that the respective plane thereof is non-parallel relative to the first and second planes;
• and
• a propulsion system operatively coupled to the at least one electronics module.

A method, comprising:

• inserting at least one electronics module into an interior space of an enclosure;
• relatively aligning at least one interlocking feature of the at least one electronics module with at least one interlocking feature of the interior surface of the enclosure;
• and
• engaging the at least one interlocking feature of the at least one electronics module with the at least one interlocking feature of the interior surface of the enclosure.