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US 8,189,328 B2Granted
Methods and apparatus of dual inline memory modules for flash memory
AssigneeVirident Systems Inc.
InventorsRuban Kanapathippillai, Kenneth Alan Okin
Life of this patent
Estimating the term…
Abstract
In one embodiment of the invention, a flash memory dual inline memory module (FMDIMM) is disclosed. The FMDIMM includes a printed circuit board (PCB) with an edge connector; a first plurality of multi-chip packaged flash memory/support application specific integrated circuit (ASIC) parts mounted to the printed circuit board and electrically coupled to the edge connector; and a first address device mounted to the PCB and electrically coupled to the edge connector and the first plurality of multi-chip packaged flash memory/support ASIC parts. Each of the first plurality of multi-chip packaged flash memory/support ASIC parts includes one or more randomly accessible flash memory die to periodically store data in a non-volatile manner.
Claims28
A flash memory dual inline memory module (DIMM) comprising:
- a printed circuit board with an edge connector;
- a first plurality of multi-chip packaged flash memory/support application specific integrated circuit (ASIC) parts mounted to the printed circuit board and electrically coupled to the edge connector, each of the first plurality of multi-chip packaged flash memory/support ASIC parts including
- one or more randomly accessible flash memory die to periodically store data in a non-volatile manner, wherein the one or more randomly accessible flash memory die operate with a power supply voltage level differing from a power supply voltage level to be provided at the edge connector, and
- one or more circuits to convert one or more voltages to that used to operate the randomly accessible flash memory die to avoid mounting power conversion circuit to the printed circuit board and increasing the height thereof;
- and
- a first address device mounted to the printed circuit board and electrically coupled to the edge connector and the first plurality of multi-chip packaged flash memory/support ASIC parts.
3 more elements
A flash memory dual inline memory module (DIMM) comprising:
- a printed circuit board with an edge connector;
- a first plurality of multi-chip packaged flash memory/support application specific integrated circuit (ASIC) parts mounted to the printed circuit board and electrically coupled to the edge connector, each of the first plurality of multi-chip packaged flash memory/support ASIC parts including
- one or more randomly accessible flash memory die to periodically store data in a non-volatile manner, wherein the one or more randomly accessible flash memory die operate with a power supply voltage level differing from a power supply voltage level to be provided at the edge connector, and
- an application specific integrated circuit die including one or more circuits to convert one or more voltages to that used to operate the one or more randomly accessible flash memory die to avoid mounting power conversion circuitry to the printed circuit board and increasing the height of the printed circuit board.
1 more element
A flash memory dual inline memory module (DIMM) comprising:
- printed circuit board with an edge connector,
- a first plurality of multi-chip packaged flash memory/support application specific integrated circuit (ASIC) parts mounted in a parallel row to a front side of the printed circuit board and electrically coupled to the edge connector, each of the first plurality of multi-chip packaged flash memory/support ASIC parts including one or more randomly memory die to periodically store data in a non-volatile manner;
- a second plurality of multi-chip packaged flash memory/support ASIC parts mounted in a parallel row to a back side of the printed circuit board and electrically coupled to the edge connector, each of the second plurality of multi-chip packaged flash memory/support ASIC parts including one or more randomly accessible flash memory die to periodically store data in a non-volatile manner;
- wherein the first plurality of multi-chip packaged flash memory/support ASIC parts include a front/back control signal input set to a front mode setting indicating to circuits therein that they are mounted to the front side of the printed circuit board;
- and
- wherein the second plurality of multi-chip packaged flash memory/support ASIC parts include a front/back control signal input set to a back mode setting indicating to circuits therein that they are mounted to the back side of the printed circuit board.
3 more elements
A flash memory dual inline memory module (DIMM) comprising:
- a printed circuit board with an edge connector;
- a first plurality of multi-chip packaged flash memory/support application specific integrated circuit (ASIC) parts mounted to the printed circuit board and electrically coupled to the edge connector, each of the first plurality of multi-chip packaged flash memory/support ASIC parts including an application specific integrated circuit (ASIC) die mounted to a substrate and one or more randomly accessible flash memory die mounted to the substrate and electrically coupled to the ASIC die, the one or more randomly accessible flash memory die to periodically store data in a non-volatile manner,
- wherein the one or more randomly accessible flash memory die operate with a power supply voltage level differing from a power supply voltage level to be provided at the edge connector and the ASIC die includes one or more circuits to translate signal voltages for signals communicated between the edge connector and the randomly accessible flash memory die.
Dependencies are inferred from the claim text.