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US 8,188,373 B2Granted
Insulating layer for rigid printed circuit boards
AssigneeIntegral Technology, Inc.
InventorChristopher A. Hunrath
Life of this patent
Estimating the term…
Abstract
One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
Claims22
A device for mounting electrical components, the device comprising:
- a printed circuit board having a planar dimension many times greater than any one electrical component mounted thereon, the printed circuit board comprising:
- a surface conductive layer configured to interface with the electrical components via at least one lead-free solder component, wherein the surface conductive layer comprises copper;
- a strain resistant cap layer configured to engage the surface conductive layer, wherein the strain resistant cap layer comprises polyimide and an inorganic filler for increasing the strength of the cap layer, the tensile strength of the cap layer being about 25,000-35,000 psi, wherein the elongation of the cap layer is about 15-35%;
- and
- at least one rigid insulating layers laminated to the strain resistant layer without a bonding layer, wherein the at least one rigid insulating layers extends throughout the entire length of the printed circuit board such that the entire printed circuit board defines a rigid printed circuit board;
- wherein the at least one rigid insulating layer has a tensile strength which is at least 1.3 times greater than the strain resistant cap layer.
3 more elements
A printed circuit board having a planar dimension many times greater than any one electrical component mounted thereon comprising:
- a conductive layer configured to interface with electrical components mounted on the printed circuit board;
- a strain resistant layer defining a cap layer engaging the conductive layer, wherein the strain resistant layer comprises ductility between about 15% and 50% and tensile strength of at least about 10,000 psi, the strain resistant layer further comprising a filler;
- and
- at least one rigid insulating layer laminated to the strain resistant layer, without a bonding layer, the insulating layer extending throughout the entire length of the printed circuit board, wherein the entire printed circuit board comprises substantially rigid portions;
- wherein the rigid insulating layer has a tensile strength that is greater than the tensile strength of the strain resistant layer.
2 more elements
A device for mounting electrical components, the device comprising:
- a printed circuit board comprising;
- a surface conductive layer configured to interface with the electrical components via at least one lead-free solder component, wherein the surface conductive layer comprises copper;
- a strain resistant cap layer configured to engage the surface conductive layer, wherein the strain resistant cap layer comprises polyimide and an inorganic filler, wherein the elongation of the cap layer is about 15-50%;
- and
- at least one rigid insulating layer laminated to the strain resistant layer, wherein the at least one rigid insulating layer extends throughout the entire length of the printed circuit board such that the entire printed circuit board defines a rigid printed circuit board;
- wherein the rigid insulating layer has a tensile strength that is greater than the tensile strength of the strain resistant layer.
3 more elements
Dependencies are inferred from the claim text.