Photosensitive resin composition and photosensitive film
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsKuon Miyazaki, Takashi Hayakawa
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Abstract
Disclosed is a photosensitive resin composition comprising an alkali-soluble resin, wherein the dissolution rate of the alkali-soluble resin in an aqueous sodium carbonate solution is not less than 0.04 μm/sec. When a photosensitive layer having a thickness of 30 μm is formed by applying the photosensitive resin composition onto a base and removing the solvent by heating, and thus-obtained photosensitive layer is irradiated with an active ray of 1000 mJ/cm2 or less, the dissolution rate of the portion irradiated with the active ray in the photosensitive layer made of the photosensitive resin composition is not less than 0.22 μm/sec and the film residual rate of the portion not irradiated with the active ray is not less than 90%.
Claims21
A photosensitive resin composition comprising at least (A′) a polyamide acid represented by formula (8), (B) a dissolution suppressing agent which is at least one selected from 3′-hydroxyphenyl acetanilide, 4′-hydroxyphenyl acetanilide, 4-hydroxyphenyl benzamide, and 3-hydroxyphenyl urea, (C) a photosensitizing agent, and (D) an organic solvent excluding the compound which is identical to the one constituting (B):
- in formula (8), R25 represents a tetravalent organic group having two or more carbons, and R26 represents a divalent organic group having two or more carbons.
Dependencies are inferred from the claim text.