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US 8,187,480 B2Granted
Ultra thin alignment walls for di-block copolymer
AssigneeSeagate Technology LLC
InventorsKim Yang Lee, David S. Kuo, Dorothea Buechel, Kalman Pelhos
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Abstract
Methods comprising providing a pre-patterned substrate having an array of thick walls, depositing a conforming layer on the pre-patterned substrate, etching the conforming layer from the top of the thick walls and the space between the walls, and etching the thick walls while leaving thin walls of conforming layer.
Claims20
A method comprising:
- depositing a conforming layer on a pre-patterned substrate, the substrate having an array of walls each with a predetermined thickness;
- etching the conforming layer to a top of the walls and between the walls to form conforming layer walls thinner than and adjacent to the array of walls;
- removing the array of walls;
- depositing a diblock copolymer on the substrate between the thinner conforming layer walls;
- allowing the diblock copolymer to phase separate into a continuous phase and a discrete phase, the discrete phase comprising an array of domains aligned with the thinner conforming layer walls;
- etching away one phase of the diblock copolymer;
- etching the pre-patterned substrate using the other one of the phases of the diblock copolymer as a resist pattern;
- and
- removing the other one of the phases of the diblock copolymer and the thinner conforming layer walls, wherein the etched pre-patterned substrate forms an imprint stamp for fabricating a magnetic storage device.
6 more elements
A method comprising:
- forming a plurality of walls on a pre-patterned substrate;
- forming one or more domains between each of one or more adjacent pairs of the walls;
- and
- etching the substrate using the plurality of walls and the one or more domains as a resist pattern to form an imprint stamp for fabricating a magnetic storage device.
1 more element
Dependencies are inferred from the claim text.