High density electrical connector with variable insertion and retention force

A method of operating an electrical connector comprising a plurality of conductive elements, each conductive element comprising a mating contact portion, the method comprising:

• aligning the connector with a mating connector;
• moving the connector and the mating connector towards each other over a first distance;
• as the connector and the mating connector are moving over the first distance, deflecting each mating contact relative to a first deflection point, the first deflection point being a first length from an end of the mating contact;
• further moving the connector and the mating connector towards each other over a second distance;
• and
• as the connector and the mating connector are moving over the second distance, deflecting each mating contact relative to a second deflection point, the second deflection point being a second length from the end of the mating contact.

An electrical connector comprising:

• a plurality of wafer subassemblies, each wafer subassembly comprising:
• a front housing portion comprising:
• a first column and a second column, each column comprising at least one cavity, each cavity in the first column and the second column having a rearward opening;
• an insulative member between the first column and the second column, the insulative member comprising a first surface adjacent the first column and a second surface adjacent the second column;
• at least one first projection on the first surface, the at least one first projection being positioned parallel to and a first distance from the first column;
• and
• at least one second projection on the second surface, the at least one second projection being positioned parallel to and a first distance from the second column;
• a first wafer, the first wafer comprising a first housing and a first plurality of conductive elements, each conductive element of the first plurality of conductive elements comprising a mating contact portion extending from the first housing by a second distance, the second distance greater than the first distance, and each conductive element comprising an end disposed within a cavity of the first column;
• and
• a second wafer, the second wafer comprising a second housing and a second plurality of conductive elements, each conductive element of the second plurality of conductive elements comprising a mating contact portion extending from the second housing by the second distance, each conductive element comprising an end disposed within a cavity of the second column.

A daughter card connector adapted to mate with a backplane connector, the daughter card connector comprising:

• an insertion end constructed and arranged to mate with a receiving portion of the backplane connector;
• a surface having a protrusion disposed at a middle region of the surface offset from the insertion end, the surface having a mating direction, the protrusion being elongated in a direction substantially perpendicular to the mating direction;
• and
• a plurality of mating contacts disposed adjacent to the surface, the mating contacts being constructed and arranged such that a middle portion of each mating contact is spaced from the protrusion when the daughter card and the backplane connector are unmated and presses against the protrusion upon mating of the insertion end with the receiving portion such that a force exists between middle portions of the mating contacts.