Redundantable robot assembly for workpiece transfer
AssigneeDynamic Micro Systems, Semiconductor Equipment GmbH
InventorLutz Rebstock
Life of this patent
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Abstract
A redundantable robotic mechanism is disclosed for improving reliability of tranport equipment. The redundantable robot assembly typically comprises independent robots with separate controls, motors, linkage arms, or power, thus providing the capability of operation even if parts of the assembly are not operational or when parts of the assembly are removed for repair. The redundantable robot assembly can be also designed to allow in-situ servicing, e.g. servicing one robot when the other is running. The disclosed redundantable robot assembly provides virtual uninterrupted process flow, and thus greatly increases the yield for the manufacturing facility.
Claims20
A redundantable workpiece transfer mechanism for semiconductor workpiece transfer, comprising
- at least two stationary and independent workpiece transfer assemblies,
- wherein each stationary and independent workpiece transfer assembly is capable of transferring workpieces regardless of operating statuses of other workpiece transfer assemblies;
- and
- an ejection mechanism comprising a swinging mechanism connected to at least one of the workpiece transfer assemblies to swing the at least one of the workpiece transfer assemblies to a serviceable area.
A semiconductor equipment having workpiece movement, comprising
- two stations;
- a redundantable workpiece transfer mechanism comprising at least two stationary and independent workpiece transfer assemblies for transferring workpieces between the stations,
- wherein each stationary and independent workpiece transfer assembly is capable of transferring the workpieces regardless of operating statuses of other workpiece transfer assemblies;
- and
- a controller for providing a service zone adjacent the workpiece transfer assemblies for safe servicing an inoperative workpiece transfer assembly while the other workpiece transfer assemblies still operate,
- wherein the service zone adjacent the workpiece transfer assemblies comprises an ejection mechanism to move the transfer assemblies to a serviceable area, and
- wherein the ejection mechanism comprises a swinging mechanism connected to each workpiece transfer assembly to separately swing each workpiece transfer assembly to the serviceable area.
A semiconductor equipment having workpiece movement, comprising
- two stations;
- a redundantable workpiece transfer mechanism comprising at least two stationary and independent workpiece transfer assemblies for transferring workpieces between the stations,
- wherein each stationary and independent workpiece transfer assembly is capable of transferring the workpieces regardless of operating statuses of other workpiece transfer assemblies;
- a controller for coordinating the transferring of the workpieces,
- wherein the controller recognizes an operating status of each of the workpiece transfer assemblies, and
- wherein the controller assigns the transferring of the workpieces to operative workpiece transfer assemblies;
- and
- an ejection mechanism comprising a swinging mechanism connected to at least one of the transfer assemblies to swing the at least one of the transfer assemblies to a serviceable area.
Dependencies are inferred from the claim text.