Substrate processing apparatus and attaching/detaching method of reaction vessel
AssigneeHitachi Kokusai Electric Inc.
InventorsKoji Shibata, Masahiro Tatta
Life of this patent
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Abstract
To provide a substrate processing apparatus, comprising: a reaction vessel having a processing chamber inside that processes a substrate; a heating device that heats said substrate from an outer peripheral side of the reaction vessel; a lid member that closes the processing chamber; an attachment/detachment jig placed on the lid member for attaching/detaching the reaction vessel from an inside of the heating device; and a support section provided in an upper side of a lower end of the reaction vessel on an inside wall of the reaction vessel, and abutted on an upper surface of the attachment/detachment jig for attaching/detaching the reaction vessel from the inside of the heating device.
Claims17
A substrate processing apparatus, comprising:
- a reaction vessel having a processing chamber inside that processes a substrate;
- a heating device that heats said substrate from an outer peripheral side of the reaction vessel;
- a lid member that closes said processing chamber;
- an attachment/detachment jig placed on said lid member for attaching/detaching said reaction vessel from an inside of said heating device;
- and
- a support section provided above a lower end of the reaction vessel on an inside wall of said reaction vessel, and abutted on an upper surface of said attachment/detachment jig for attaching/detaching said reaction vessel from the inside of said heating device.
A substrate processing apparatus, comprising:
- a reaction vessel having inside a processing chamber that processes a substrate;
- a heating device that heats said substrate from an outer peripheral side of this reaction vessel;
- a lid member that closes said processing chamber;
- an attachment/detachment jig placed on said lid member when said reaction vessel is attached in the inside of said heating device;
- and
- a support section provided above a lower end of said reaction vessel on an inside wall of said reaction vessel, and abutted on said attachment/detachment jig for attaching said reaction vessel in the inside of said heating device.
A manufacturing method of a semiconductor device, comprising the steps of:
- making a support section provided above a lower end of a reaction vessel on an inner wall of said reaction vessel and an attachment/detachment jig placed on a lid member that closes said reaction vessel abut on each other and attaching said reaction vessel in the inside of a heating device;
- detaching said attachment/detachment jig from said lid member;
- and
- closing a processing chamber provided in the inside of said attached reaction vessel by said lid member and heating and processing a substrate by said heating device from an outer peripheral side of said reaction vessel.
Dependencies are inferred from the claim text.