Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diode
AssigneeIcemos Technology Ltd.
InventorsRobin Wilson, Conor Brogan, Hugh J. Griffin, Cormac MacNamara
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AssigneeIcemos Technology Ltd.
InventorsRobin Wilson, Conor Brogan, Hugh J. Griffin, Cormac MacNamara
Estimating the term…
A positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diode includes a semiconductor substrate having first and second main surfaces opposite to each other. The semiconductor substrate is of a first conductivity. The PIN/NIP diode includes at least one trench formed in the first main surface which defines at least one mesa. The trench extends to a first depth position in the semiconductor substrate. The PIN/NIP diode includes a first anode/cathode layer proximate the first main surface and the sidewalls and the bottom of the trench. The first anode/cathode layer is of a second conductivity opposite to the first conductivity. The PIN/NIP diode includes a second anode/cathode layer proximate the second main surface, a first passivation material lining the trench and a second passivation material lining the mesa. The second anode/cathode layer is the first conductivity.
A positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diode comprising:
Dependencies are inferred from the claim text.