Method of packaging integrated circuits
AssigneeSTMicroelectronics S.r.l.
InventorsMichael J. Hundt, Tiao Zhou
Life of this patent
Estimating the term…
Abstract
The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.
Claims20
A method of packaging integrated circuits comprising:
- clamping an upper mold portion and a lower mold portion around an integrated circuit die mounted on an upper surface of a packaging substrate, the upper and lower mold portions contacting upper and lower surfaces of the packaging substrate, respectively, during clamping;
- and
- bringing a surface on a projection within the upper mold portion into contact with an active area of the integrated circuit die during mold clamping, wherein the contacted active area remains exposed after encapsulation,
- wherein a deformable material is disposed on a surface of the lower mold portion, the deformable material having a soft deformable upper surface that contacts the bottom surface of the packaging substrate during mold clamping, the deformable material deforming during mold clamping as necessary to compensate for misalignment between the projection surface and the active area of the integrated circuit die and to thereby prevent injected encapsulating material from flowing between the projection surface and the contact area.
A method of packaging integrated circuits comprising:
- clamping an upper mold portion and a lower mold portion around an integrated circuit die mounted on an upper surface of a packaging substrate, the upper and lower mold portions contacting upper and lower surfaces of the packaging substrate, respectively, and a surface on a projection within the upper mold portion contacting an active area of the integrated circuit die during clamping, wherein the contacted active area remains exposed after encapsulation,
- wherein a deformable material on a surface of the lower mold portion contacts the bottom surface of the packaging substrate during mold clamping, the deformable material having a deformable upper surface contacting the bottom of the packaging substrate, the deformable upper surface of the deformable material deforming during mold clamping as necessary to compensate for misalignment between the projection surface and the active area of the integrated circuit die and to thereby prevent injected encapsulating material from flowing between the projection surface and the contact area.
A method comprising:
- receiving a substrate between a first mold portion, and a second mold portion,
- the first mold portion having a surface on a projection thereon contacting an active area of the substrate during clamping, wherein the contacted active area remains exposed after encapsulation, the second mold portion having a base and a deformable material on at least a portion of the base, the deformable material having an upper surface including a region that contacts at least a portion of the substrate during mold clamping and that is deformable within the region that contacts the substrate during mold clamping, the deformable portion of the upper surface of the deformable material deforming during mold clamping to compensate for misalignment between the projection surface and the active area of the substrate and to thereby prevent injected encapsulating material from flowing between the projection surface and the active area.
Dependencies are inferred from the claim text.