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US 8,163,185 B1Granted
Method and apparatus for lifting off photoresist beneath an overlayer
AssigneeWestern Digital (Fremont), LLC
InventorsHai Sun, Liubo Hong, Rowena Schmidt, Lijie Zhao, Winnie Yu, Hongping Yuan
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Abstract
A method of lifting off photoresist beneath an overlayer includes providing a structure including photoresist and depositing an overlayer impenetrable to a liftoff solution over the photoresist and a field region around the structure. The method also includes forming a mask over the structure and ion milling to remove the overlayer in the field region not covered by the mask. The method then includes lifting off the photoresist using the liftoff solution.
Claims10
A method of lifting off photoresist beneath an overlayer, comprising:
- providing a structure including photoresist,
- depositing an overlayer impenetrable to a liftoff solution over the photoresist and a field region around the structure;
- forming a mask over the structure;
- ion milling to remove the overlayer in the field region not covered by the mask;
- and
- lifting off the photoresist using the liftoff solution.
3 more elements
Dependencies are inferred from the claim text.