Wiring structure for use in micro piezoelectric pump

A micro piezoelectric pump, comprising:

• a body having a top surface and a bottom surface each formed with a recess, wherein the recess on the bottom surface of the body is formed with two cavities, and two check valves are embedded in the two cavities, respectively, allowing two through holes to be formed between the two cavities and the recess on the top surface of the body;
• a driving circuit board provided with a driving circuit for driving a piezoelectric element, and having a bottom surface provided with at least an electrical contact, wherein the electrical contacts are electrically connected to the driving circuit, wherein the driving circuit board is disposed in the recess of the top surface of the body;
• a wiring structure sandwiched in between the driving circuit board and the piezoelectric element, comprising:
• a first interface ring being a substrate made of an electrically insulated material, having a top surface provided with at least a first upper pad, having a bottom surface provided with at least a first lower pad corresponding in position to the at least a first upper pad, paired said first upper and lower pads being electrically connected to each other, the first interface ring abutting against the bottom surface of the driving circuit board, the first upper pads being in contact with the electrical contacts on the bottom surface of the driving circuit board, wherein the first upper pads and the first lower pads are made of an electrically conductive material;
• a first metal ring circumferentially formed with a plurality of dents corresponding in position to each other, and formed with at least a cantilever extending centripetally and at least a contact, the contact being provided at the tip of the cantilever, wherein the first metal ring abuts against a bottom surface of the first interface ring so as to be in contact with a portion of the first lower pads of the first interface ring, allowing another portion of the first lower pads to go through the dents;
• a second interface ring being a substrate made of an electrically insulated material, having a top surface provided with at least a second upper pad, having a bottom surface provided with at least a second lower pad corresponding in position to the at least a second upper pad, paired said second upper and lower pads being electrically connected to each other, the second interface ring abutting against the bottom surface of the first metal ring, the second upper pads being in contact with the portion of the first lower pads going through the dents, respectively, wherein the second upper pads and the second lower pads are made of an electrically conductive material;
• and
• a second metal ring abutting against the bottom surface of the second interface ring and being in contact with the second lower pads of the second interface ring;
• the piezoelectric element having a same surface defined with a first electrode contact region and a second electrode contact region electrically insulated from each other, and abutting against the bottom surface of the second metal ring, the first electrode contact region being in contact with the contact of the first metal ring, and the second electrode contact region being in contact with the second metal ring;
• a cover for covering the recess on the top surface of the body;
• and
• a bottom plate provided with two pipes corresponding in position to the two cavities of the body and configured to cover the recess on the bottom surface of the body.