# US 8,153,031 B2 · In-Ga-Zn-Sn type oxide sinter and target for physical film deposition

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- Number: US 8,153,031 B2
- Document ID: US8153031B2
- Status: Granted
- Kind: B2
- Application number: 12/599,548
- Filed: 2007-11-30
- Published: 2011-10-27
- Granted: 2012-04-10
- Earliest claimed: 2007-05-11
- Assignees: Idemitsu Kosan Co., Ltd.
- Inventors: Koki Yano; Kazuyoshi Inoue
- Web page: https://patentgrep.com/patent/US8153031B2

## CPC

- C23C 14/3414: {Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy}
- C04B 35/01: based on oxide ceramics
- C04B 35/453: based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
- C04B 35/457: based on tin oxides or stannates
- C23C 14/08: Oxides (C23C14/10 takes precedence)
- C04B 2235/3284: Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
- C04B 2235/3286: Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
- C04B 2235/3293: Tin oxides, stannates or oxide forming salts thereof, e.g. indium tin oxide [ITO]
- C04B 2235/5409: expressed by specific surface values
- C04B 2235/5436: micrometer sized, i.e. from 1 to 100 micron
- C04B 2235/5445: submicron sized, i.e. from 0,1 to 1 micron
- C04B 2235/6585: at an oxygen percentage above that of air
- C04B 2235/77: Density
- C04B 2235/80: Phases present in the sintered or melt-cast ceramic products other than the main phase
- C04B 2235/963: Surface properties, e.g. surface roughness
- H10P 14/22: using physical deposition, e.g. vacuum deposition or sputtering
- H10P 14/3426: {Oxides}
- H10P 14/3434: {being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424)}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

An oxide sintered body including an indium element (In), a gallium element (Ga), a zinc element (Zn) and a tin element (Sn), and including a compound shown by Ga2In6Sn2O16 or (Ga,In)2O3.

## Claims

### Claim 1

An oxide sintered body comprising an indium element (In), a gallium element (Ga), a zinc element (Zn) and a tin element (Sn), and comprising a compound shown by Ga2In6Sn2O16 or (Ga,In)2O3.

### Claim 2 (depends on 1)

The oxide sintered body according to claim 1, wherein the atomic ratio of each element to the total (In+Ga+Zn+Sn) of the indium element (In), gallium element (Ga), zinc element (Sn) and tin element (Sn) satisfies the following relationships:
0.15<In/(In+Ga+Zn+Sn)<0.8
0.05<Ga/(In+Ga+Zn+Sn)<0.5
0.05<Zn/(In+Ga+Zn+Sn)<0.6
0.05<Sn/(In+Ga+Zn+Sn)<0.7.

### Claim 3 (depends on 1)

A target for physical film formation which comprises the oxide sintered body according to claim 1.

### Claim 4 (depends on 3)

The target for physical film formation according to claim 3, which is a sputtering target having a bulk resistance of less than 20 mΩcm.

### Claim 5 (depends on 3)

An oxide semiconductor film formed by sputtering the target according to claim 3.

### Claim 6 (depends on 5)

A thin film transistor which comprises as an active layer the oxide semiconductor film according to claim 5.

### Claim 7

An oxide sintered body comprising an indium element (In), a gallium element (Ga), a zinc element (Zn) and a tin element (Sn), and comprising a compound shown by Ga2In6Sn2O16 and a compound shown by In2O3.

### Claim 8 (depends on 7)

A target for physical film formation which comprises the oxide sintered body according to claim 7.

### Claim 9 (depends on 8)

An oxide semiconductor film formed by sputtering the target according to claim 8.

### Claim 10 (depends on 9)

A thin film transistor which comprises as an active layer the oxide semiconductor film according to claim 9.

### Claim 11

An oxide sintered body comprising an indium element (In), a gallium element (Ga), a zinc element (Zn) and a tin element (Sn), and comprising a compound shown by Ga2In6Sn2O16 and a compound shown by InGaZnO4.

### Claim 12 (depends on 11)

A target for physical film formation which comprises the oxide sintered body according to claim 11.

### Claim 13 (depends on 12)

An oxide semiconductor film formed by sputtering the target according to claim 12.

### Claim 14 (depends on 13)

A thin film transistor which comprises as an active layer the oxide semiconductor film according to claim 13.

### Claim 15

An oxide sintered body comprising an indium element (In), a gallium element (Ga), a zinc element (Zn) and a tin element (Sn), and comprising as a main component a compound shown by Ga2.4In5.6Sn2O16.

### Claim 16 (depends on 15)

A target for physical film formation which comprises the oxide sintered body according to claim 15.

### Claim 17 (depends on 16)

An oxide semiconductor film formed by sputtering the target according to claim 16.

### Claim 18 (depends on 17)

A thin film transistor which comprises as an active layer the oxide semiconductor film according to claim 17.
