# US 8,148,645 B2 · Wiring substrate and method of manufacturing the same

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- Number: US 8,148,645 B2
- Document ID: US8148645B2
- Status: Granted
- Kind: B2
- Application number: 12/189,852
- Filed: 2008-08-12
- Published: 2009-10-29
- Granted: 2012-04-03
- Earliest claimed: 2007-10-18
- Assignees: Ibiden Co., Ltd.
- Inventors: Kazuhiro Yoshikawa
- Web page: https://patentgrep.com/patent/US8148645B2

## CPC

- H05K 1/162: {incorporating printed capacitors}
- H05K 1/113: {Via provided in pad; Pad over filled via}
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated}
- H05K 2201/09309: Core having two or more power planes; Capacitive laminate of two power planes
- H05K 2201/09718: Clearance holes
- H05K 2201/10515: Stacked components
- H05K 2201/10712: Via grid array, e.g. via grid array capacitor
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacitor includes a plurality of capacitors laminated to each other by adhesive, each capacitor including a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes. A first via conductor electrically connects the first electrodes of the plurality of capacitors to each other, and a second via conductor electrically connects the second electrodes of the plurality of capacitors to each other. A first external terminal electrically connects to the first via conductor, and a second external terminal electrically connects to the second via conductor.

## Claims

### Claim 1

A wiring substrate comprising:
a base substrate;
a first resin insulating layer provided on the base substrate;
a laminated capacitor formed within the first resin insulating layer, the laminated capacitor comprising a plurality of capacitors laminated to each other by adhesive, each capacitor including a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes;
a first via conductor electrically connecting the first electrodes of the plurality of capacitors to each other;
a second via conductor electrically connecting the second electrodes of the plurality of capacitors to each other;
a first external terminal electrically connected to the first via conductor;
a second external terminal electrically connected to the second via conductor
a plurality of conductor patterns provided on the base substrate; and
a plurality of conductor patterns provided on the first resin insulating layer, wherein
an end face of the laminated capacitor is substantially coplanar with an end face of the first resin insulating layer,
the first via conductor electrically connects one of the conductor patterns on the base substrate with a respective one of the conductor patterns on the first resin insulating layer,
the second via conductor electrically connects another one of the conductor patterns on the base substrate with another respective one of the conductor patterns on the first resin insulating layer, and
a conductor pattern on the first resin insulating layer and the first electrode of the capacitor at an end face of the laminated capacitor are integrated so as to form an integral electrode.

### Claim 2 (depends on 1)

The wiring substrate of claim 1, wherein:
the first electrode and second electrode are offset from each other,
the first via conductor penetrates end portions of the first electrodes such that the first via conductor electrically connects the first electrodes, and
the second via conductor penetrates end portions of the second electrodes such that the second via conductor electrically connects the second electrodes.

### Claim 3 (depends on 1)

The wiring substrate of claim 1, further comprising a second resin insulating layer provided on the first resin insulating layer.

### Claim 4 (depends on 3)

The wiring substrate of claim 3, further comprising:
a plurality of conductor patterns provided on the base substrate; and
a plurality of conductor patterns provided on the second resin insulating layer, wherein the first via conductor electrically connects one of the conductor patterns on the base substrate with a respective one of the conductor patterns on the second resin insulating layer, and the second via conductor electrically connects another one of the conductor patterns on the base substrate with another respective one of the conductor patterns on the second resin insulating layer.

### Claim 5 (depends on 3)

The wiring substrate of claim 3, further comprising a third resin insulating layer provided on the second resin insulating layer.

### Claim 6 (depends on 5)

The wiring substrate of claim 5, further comprising:
a plurality of conductor patterns provided on the second resin insulating layer; and
a plurality of conductor patterns provided on the third resin insulating layer.

### Claim 7 (depends on 6)

The wiring substrate of claim 6, further comprising a third via conductor electrically connecting one of the conductor patterns on the second resin insulating layer with a respective one of the conductor patterns on the third resin insulating layer.

### Claim 8 (depends on 1)

The wiring substrate as set forth in claim 1, wherein:
each of the first electrodes comprises a first opening portion,
each of the second electrodes comprises a second opening portion,
the first via conductor electrically connects the first electrodes while passing through the second opening portions without being in contact with the second electrodes; and
the second via conductor electrically connects the second electrodes while passing through the first opening portions without being in contact with the first electrodes.

### Claim 9 (depends on 1)

The wiring substrate of claim 1, wherein the adhesive comprises a resin forming the first resin insulating layer.

### Claim 10

A wiring substrate comprising:
a plurality of resin insulating layers including at least a first end resin insulating layer and a second end resin insulating layer;
a plurality of conductor circuits interposed between the end resin insulating layers;
a laminated capacitor embedded in one of the resin insulating layers, the laminated capacitor comprising a plurality of capacitors laminated to each other by adhesive, each capacitor including a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes;
a first via conductor electrically connecting the first electrodes of the plurality of capacitors to each other;
a second via conductor electrically connecting the second electrodes of the plurality of capacitors to each other;
a plurality of first external connection terminals formed on the first end resin insulating layer and comprising a first external terminal electrically connected to the first via conductor and a second external terminal electrically connected to the second via conductor; and
a plurality of second external connection terminals formed in the second end resin insulating layer and comprising a third external terminal electrically connected to the first via conductor and a fourth external terminal electrically connected to the second via conductor, wherein the first external connection terminals are formed on the first end resin insulating layer and have external terminal faces positioned on nearly the same plane as a face of the first end resin insulating layer, and the second external connection terminals are embedded in the second end resin insulating layer.

### Claim 11

A method of manufacturing a wiring substrate comprising:
forming a plurality of capacitors each comprising a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes;
forming a laminated capacitor by laminating the plurality of capacitors to each other with adhesive;
laminating a first resin insulating layer on a base substrate;
embedding the laminated capacitor in the first resin insulating layer;
forming a first through hole penetrating the first electrodes of the plurality of capacitors;
forming a second through hole penetrating the second electrodes of the plurality of capacitors;
forming a first via conductor electrically connecting the first electrodes of the plurality of capacitors by filling the first through hole with metal;
forming a second via conductor electronically connecting the second electrodes of the plurality of capacitors by filling the second through hole with metal;
forming a first external terminal electrically connected to the first via conductor;
forming a second external terminal electrically connected to the second via conductor conductor;
forming an integral electrode such that a conductor pattern on the first resin insulating layer and a first electrode of an end face capacitor of the laminated capacitor are integrated with each other, wherein
the embedding the laminated capacitor comprises embedding the laminated capacitor in the first resin insulating layer such that a first end face of the laminated capacitor and a first end face of the first resin insulating layer sit at a same level,
the forming a first via-conductor comprises providing the first via conductor electrically connecting a conductor pattern on the base substrate to a conductor pattern on the first resin insulating layer, and
the forming a second via-conductor comprises providing the second via conductor electrically connecting another conductor pattern on the base substrate to another conductor pattern on the first resin insulating layer.

### Claim 12 (depends on 11)

The method of claim 11, wherein:
the forming a laminated capacitor comprises, for each of the plurality of capacitors, positioning the first electrode and second electrode offset from each other;
the forming a first through hole comprises providing the first through hole penetrating end portions of the first electrodes of the plurality of capacitors; and
said forming a second through hole comprises providing the second through hole penetrating end portions of the second electrodes of the plurality of capacitors.

### Claim 13 (depends on 11)

The method of claim 11 further comprising, following the step of embedding, laminating the second resin insulating layer on the first resin insulating layer.

### Claim 14 (depends on 13)

The method of claim 13, wherein:
the forming a first through hole comprises forming the first through hole penetrating the second insulating layer;
the forming a second through hole comprises forming the second through hole penetrating the second insulating layer;
the forming a first via-conductor comprises providing the first via conductor electrically connecting a conductor pattern on the base substrate to a respective conductor pattern on the second resin insulating layer; and
the forming a second via-conductor comprises providing the second via conductor electrically connecting another conductor pattern on the base substrate to another respective conductor pattern on the second resin insulating layer.

### Claim 15 (depends on 13)

The method of claim 13, further comprising:
following the forming of the first and second via-conductors, forming a third resin insulating layer on the second resin insulating layer; and
forming a third via conductor electrically connecting a conductor pattern on the second resin insulating layer with a respective conductor pattern on the third resin insulating layer.

### Claim 16 (depends on 11)

The method of claim 11, wherein:
the forming a laminated-capacitor comprises providing a first opening portion in each of the plurality of first electrodes and providing a second opening portion in each of the plurality of second electrodes; and
the forming a through hole comprises providing the first through hole penetrating the first electrodes while penetrating the second openings without being in contact with the second electrodes, and providing the second through hole penetrating the second electrodes while penetrating the first openings without being in contact with the first electrodes.

### Claim 17 (depends on 11)

The method of claim 11, wherein the adhesive comprises a resin forming the first resin insulating layer.

### Claim 18

A method of manufacturing a wiring substrate comprising:
forming a plurality of capacitors each having a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes;
forming a laminated capacitor by laminating the plurality of the capacitors with adhesive;
forming a plurality of first external connection terminals on a support board, the first external connection terminals including a first external terminal and a second external terminal;
alternately laminating on the first external connection terminals and on the support board a plurality of resin insulating layers and a plurality of conductor circuits;
embedding the laminated capacitor in one of the plurality of resin insulating layers;
forming a first through hole penetrating the first electrodes of the plurality of capacitors;
forming a second through hole penetrating the second electrodes of the plurality of capacitors;
forming a first via conductor electrically connecting the first electrodes by filling the first through hole with metal;
forming a second via conductor electrically connecting the second electrodes by filling the second through hole with metal;
forming a plurality of second external connection terminals including a third external terminal and a fourth external terminal on a first end resin insulting layer of the plurality of resin insulating layers and positioned on an opposite side from the support board; and
removing the support board, wherein the first external terminal and the third external terminal are electrically connected to the first via conductor, and the second external terminal and the fourth external terminal are electrically connected to the second via conductor.