# US 8,148,468 B2 · Reactive hot melt adhesive composition and method for producing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,148,468 B2 - Document ID: US8148468B2 - Status: Granted - Kind: B2 - Application number: 12/575,114 - Filed: 2009-10-07 - Published: 2010-10-14 - Granted: 2012-04-03 - Earliest claimed: 2009-04-10 - Assignees: Mitsubishi Rayon Co., Ltd. - Inventors: Kana Akeda; Koji Terada - Web page: https://patentgrep.com/patent/US8148468B2 ## CPC - C08F 124/00: Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen (cyclic esters of polyfunctional acids C08F118/00; cyclic anhydrides of unsaturated acids C08F120/00, C08F122/00) - C08F 220/06: Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof - C08G 18/4063: {Mixtures of compounds of group C08G18/62 with other macromolecular compounds} - C08G 18/6237: {Polymers of esters containing glycidyl groups of alpha-beta ethylenically unsaturated carboxylic acids; reaction products thereof} - C08G 18/6607: {with compounds of group C08G18/3203} - C09J 5/06: involving heating of the applied adhesive - C08F 220/325: {containing glycidyl radical, e.g. glycidyl (meth)acrylate} - C08G 2170/20: Compositions for hot melt adhesives - C09J 2475/00: Presence of polyurethane - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) ## Abstract Disclosed are a reactive hot melt adhesive composition having no problem in the initial adhesive strength, the adhesive strength obtained after moisture curing, stringiness and the like, and a method for producing the same. In the method, 1 to 50 parts by mass of a polymer (A), which is obtained by polymerization of a monomer composition including a vinyl monomer having a carboxyl group and a vinyl monomer having an epoxy group and has the equivalent ratio of the carboxyl group to the epoxy group in the range of 1/100 to 100/1, is mixed with 99 to 50 parts by mass in total of a polyisocyanate (B) and a polyol (C) so that the amount of the isocyanate group can become 1.1 to 10 moles relative to 1 mole of the hydroxyl group of the polyol (C), the sum of the components (A) to (C) being 100 parts by mass, and the resulting mixture is heated and mixed. ## Claims ### Claim 1 A method for producing a reactive hot melt adhesive composition, comprising heating a mixture of: a polymer (A); a polyisocyanate (B); and a polyol (C), wherein said polymer (A) is obtained by polymerizing a monomer mixture comprising a vinyl-based monomer comprising a carboxyl group and a vinyl-based monomer comprising an epoxy group, said polymer (A) comprising both carboxyl groups and epoxy groups. ### Claim 2 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, wherein a glass transition temperature of the polymer (A) is in the range of 70 to 100° C. ### Claim 3 (depends on 1, 2) A reactive hot melt adhesive composition obtained by the method according to claim 1 or 2. ### Claim 4 (depends on 3) A method for carrying out adhesion, comprising: heating and melting the reactive hot melt adhesive composition according to claim 3; applying the adhesive composition on a base material; and then moisture-curing the adhesive composition. ### Claim 5 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, wherein the acid value of polymer (A) is 1 to 200 mg KOH/g; the equivalent ratio of the carboxyl group to the epoxy group in polymer (A) is 1/75 to 75/1; polymer (A) has a weight average molecular weight (Mw) in the range of 5,000 to 50,000; and the ratio of weight average molecular weight/number average molecular weight (Mw/Mn) of polymer (A) is 4 or less. ### Claim 6 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, wherein the molar ratio of the hydroxyl group (OH) of polyol (C) to the isocyanate group (NCO) of the polyisocyanate (B), NCO/OH, in the mixture is 1.1 to 10. ### Claim 7 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, wherein the amount of polymer (A) is 1 to 50 parts by mass, and the amount of polyisocyanate (B) and polyol (C) is 50 to 99 parts by mass, relative to 100 parts by mass of the total amount of polymer (A), polyisocyanate (B) and polyol (C). ### Claim 8 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, wherein the amount of polymer (A) is 10 to 30 parts by mass, and the amount of polyisocyanate (B) and polyol (C) is 70 to 90 parts by mass, relative to 100 parts by mass of the total amount of polymer (A), polyisocyanate (B) and polyol (C). ### Claim 9 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, wherein the mixture is heated to a temperature of 80 to 140° C. ### Claim 10 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, wherein the mixture is heated to a temperature of 90 to 110° C. ### Claim 11 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, further comprising heating and mixing polymer (A), polyisocyanate (B) and polyol (C) while removing moisture under reduced pressure. ### Claim 12 (depends on 11) The method for producing a reactive hot melt adhesive composition according to claim 11, where said reduced pressure is in the range of 10 to 45 MPa. ### Claim 13 (depends on 1) The method for producing a reactive hot melt adhesive composition according to claim 1, wherein the acid value of polymer (A) is 1 to 200 mg KOH/g; the equivalent ratio of the carboxyl group to the epoxy group in polymer (A) is 1/75 to 75/1; polymer (A) has a weight average molecular weight (Mw) in the range of 5,000 to 50,000; the ratio of weight average molecular weight/number average molecular weight (Mw/Mn) of polymer (A) is 4 or less; the molar ratio of the hydroxyl group (OH) of polyol (C) to the isocyanate group (NCO) of the polyisocyanate (B), NCO/OH, in the mixture is 1.1 to 10; the amount of polymer (A) is 1 to 50 parts by mass, and the amount of polyisocyanate (B) and polyol (C) is 50 to 99 parts by mass, relative to 100 parts by mass of the total amount of polymer (A), polyisocyanate (B) and polyol (C); and the mixture is heated to a temperature of 80 to 140° C. ### Claim 14 (depends on 13) A reactive hot melt adhesive composition obtained by the method according to claim 13. ### Claim 15 (depends on 14) A method for carrying out adhesion, comprising: heating and melting the reactive hot melt adhesive composition according to claim 14; applying the adhesive composition on a base material; and then moisture-curing the adhesive composition.